Smart Packaging Solutions

Smart Packaging Solutions (sps)

Ivan Peytavin

Philippe Patrice

Olivier Brunet

Olivier Artigue

Henri Boccia

Philippe Lauri

Jean-Francois Salvo

The invention concerns a smart card comprising a card body provided with a cavity in which an electronic module incorporating a microelectronic chip is inserted, and at least one security marking designed to authenticate a component of the smart card. A first security marking is disposed on the microelectronic module, and a second security marking is disposed on the card body. The two security markings are linked by a visual identity or matching relationship indicating that the microelectronic module and the card body are original components assembled when the smart card was manufactured.

Smart card with a security element divided between card body and module

A method of manufacturing a microelectronic device with contactless operation, mainly for electronic passports. An antenna is made on a thin, flexible substrate. A perforated sheet that is thin and calibrated, and that has at least one cavity in its thickness, is placed on the substrate. A microelectronic chip is placed in each cavity of the perforated sheet and the output contacts of the microelectronic chip are connected to corresponding terminals of the antenna. The microelectronic chip is protected by sealing off the cavity that contains the chip. The method is particularly adapted for manufacturing electronic radiofrequency identification devices, in particular for electronic passports.

Method of producing a contactless microelectronic device, such as for an electronic passport

Growing community of inventors

Aix en Provence, France

Ivan Peytavin