Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

San Diego State University Research Foundation

Technische Universitaet Berlin

Kyocera International, Inc.

Ivan Ndip

Klaus-Dieter Lang

Tanja Braun

Christine Kallmayer

Andreas Ostmann

Kai Zoschke

Gerardo Aguirre

Thomas Loeher

Volker Grosser

Christian Tschoban

Arif Ege Engin

Brian Curran

Max Huhn

Harald PÖTTER

What is disclosed is a module arrangement. An antenna device and at least one electronic component are arranged next to each other and within one plane between a top side and a bottom side of the module arrangement. A shielding device which has a shielding effect relative to electromagnetic signals is located between the antenna device and the electronic component. Additionally, a method for manufacturing a module arrangement is disclosed.

Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangement

What is disclosed is a module arrangement having an antenna layer, a shielding layer, a distribution layer and a component layer. The antenna layer supports an integrated antenna device. The shielding layer has a shielding effect relative to electromagnetic signals. The distribution layer has structures for distributing signals and/or electrical energy. Finally, the component layer supports embedded electronic components. In addition, a device comprising module arrangements and a method for manufacturing a module arrangement are disclosed.

Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing

Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

Non-overlapping power/ground planes for localized power distribution network design

A wafer-level packaging based module includes an antenna board and a chip board. The antenna board includes at least one antenna layer with introduced antenna element and a shielding layer with introduced shielding element in the area of the at least one antenna element opposite to the antenna layer. The chip board includes a contacting layer, a rewiring layer opposite to the contacting layer and the shielding layer having at least one shielding element arranged on the rewiring layer. A chip layer having at least one chip is arranged between the contacting layer and the rewiring layer. Further, the chip layer includes at least one via connecting the contacting layer to the rewiring layer.

Waver-level packaging based module and method for producing the same

A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.

Module unit having integrated antennas

The invention relates to an antenna device having an antenna structure and an antenna feed line feeding the antenna structure, and a three-dimensional shape structure having at least one portion on which the antenna structure is arranged. The antenna device additionally has a substrate extending in a substrate plane, the substrate having a first side and an opposite second side, and the three-dimensional shape structure being arranged on the first side of the substrate. The at least one portion of the three-dimensional shape structure protrudes from the substrate plane and is spaced apart from the substrate in a contactless manner so that the antenna structure arranged thereon is also spaced apart from the substrate spatially and in a contactless manner.

Three-dimensional antenna device

An antenna device includes a substrate extending within a substrate plane, the substrate having a first side and an oppositely arranged second side, and a three-dimensional shape structure which is arranged on the first side and protrudes from the substrate plane, and a strip structure arranged at the three-dimensional shape structure, and a rear-side metallization which is arranged on the second side of the substrate and is electrically coupled to the strip structure so that the strip structure and the rear-side metallization form a loop antenna.

Three-dimensional loop antenna device

An antenna apparatus is provided, including: a substrate extending in a substrate plane, wherein the substrate includes a first side and an opposite second side, wherein a first antenna is arranged on the first side of the substrate, and a three-dimensional shape structure arranged on the first side and extending out of the substrate plane and across the first antenna so that the first antenna is arranged between the substrate and the three-dimensional shape structure. In addition, a second antenna is arranged on the three-dimensional shape structure.

Three-dimensional antenna apparatus having at least one additional radiator

A wafer level package with integrated antenna includes a contacting layer, an antenna layer with integrated antenna as well as a chip layer having at least one chip arranged between the contacting layer and the antenna layer. Further, means for shielding are implemented between the antenna layer and the chip layer.

Wafer level package with integrated antennas and means for shielding

A module unit includes a carrier substrate, an antenna substrate as well as sealants. The carrier substrate includes a chip arranged on a first main surface as well as a spacer arranged on the first main surface. The antenna substrate includes at least one antenna structure. The sealants hermetically seal off the antenna substrate and the carrier substrate in an edge area and connect same to each other. The antenna substrate is connected to the carrier substrate via the spacer, so that a cavity is formed between the chip and the antenna substrate.

Hermetically sealed module unit with integrated antennas

A wafer level package with at least one integrated antenna element includes a chip layer with at least one chip, a dielectric layer as well as an antenna layer arranged between the chip layer and the dielectric layer.

Wafer level package with at least one integrated antenna element

An antenna device includes a substrate having a first main side and a second main side located opposite the first main side, wherein a metallization is arranged, at least in portions, on the second main side of the substrate, wherein at least one flat antenna and at least one three-dimensional antenna are arranged on the first main side of the substrate, wherein the flat antenna extends, within a plane, in parallel with one of the two main sides of the substrate, and wherein the three-dimensional antenna is spaced apart, at least in portions, from the first main side of the substrate, and wherein the three-dimensional antenna and the flat antenna are galvanically connected to each other and a) include a shared signal feeding portion or b) the three-dimensional antenna and the flat antenna are serially coupled.

Ndip antenna

An antenna apparatus includes a substrate including a first main side and a second main side arranged opposite thereto. The antenna apparatus further includes a first and a second fixing region arranged at the first main side. The antenna apparatus includes a ribbon connecting the first fixing region and the second fixing region, which is at least regionally spaced apart from the substrate. Furthermore, the antenna apparatus includes a metallization arranged at the second main side, which is arranged opposite to at least one of the first fixing region, the second fixing region and the ribbon.

Ribbon bond antennas

An antenna apparatus includes a radio-frequency chip arranged on a substrate, wherein the radio-frequency chip includes at least one antenna output terminal and the antenna output terminal functions as a first fixing region for an electric conductor. The antenna apparatus further includes a first bond wire connecting in an electrically conducting manner the first fixing region to a second fixing region arranged on the substrate. Furthermore, the antenna apparatus includes a second bond wire connecting in an electrically conducting manner the second fixing region and a third fixing region arranged on the substrate. According to the invention, the first and the second bond wire electrically connected in series form an antenna. In this case, the first and second bond wires are at least regionally spaced apart from the substrate.

Antenna apparatus having bond wires

A wafer level package with integrated antenna includes a contacting layer, a redistribution layer as well as a chip layer arranged between the contacting layer and the redistribution layer. An antenna is integrated in the redistribution layer. The antenna is shielded from the chip by means of a via, offset and provided with a reflector. Alternatively, the antenna can also be provided as antenna element in the chip layer.

Growing community of inventors

Berlin, Germany

Ivan Ndip