International Business Machines Corporation

Ivan L Wemple

John Maxwell Cohn

Paul Steven Zuchowski

Douglas Willard Stout

Joseph Andrew Iadanza

Peter Anton Habitz

Robert J Allen

Sebastian Theodore Ventrone

David James Hathaway

Scott Whitney Gould

Allen Prescott Haar

Anthony Richard Bonaccio

Gustavo Enrique Tellez

Juergen Koehl

William C Leipold

Stephen Dale Wyatt

Thomas B Chadwick, Jr

Jason Edward Rotella

Margaret R Charlebois

Umberto Garofano

Ying Liu

Joseph N Kozhaya

Jeanne P Bickford

Michael Anthony Sorna

Richard Stephen Graf

Emrah Acar

Ronald Dennis Rose

Susan K Lichtensteiger

Tad Jeffrey Wilder

Jack Robert Smith

Mark William Kuemerle

Kevin W McCullen

Patrick H Buffet

Raminderpal Singh

Charles S Chiu

Shiu Chung Ho

Eric W Tremble

Faraydon Pakbaz

Richard Daniel Kimmel

Erich C Schanzenbach

James Venuto

Kurt A Carlsen

Robert A Proctor

Ali Sadigh

James E Jasmin

Timothy S Lehner

Ze Gui Pang

Paul D Montane

David Toub

An integrated circuit includes logic regions and dynamically adjustable voltage controllers. A voltage controller connected to each logic region enables voltage adjustment while the chip is operating. Each voltage controller has a selector device connected to voltage input lines providing different voltages. A voltage sensor connected to the output of the selector device provides a supply voltage to one of the logic regions. A control circuit dynamically monitors the supply voltage, captures and stores a digital representation of the supply voltage during each cycle of a clock, and tracks variations over time, based on operation of the logic regions. When variations in the supply voltage exceed an operational threshold of one of the logic regions, the control circuit submits a request to a central controller. When the central controller grants permission, the control circuit dynamically adjusts the voltage by enabling the selector device to choose a different voltage input line.

Real-time adaptive voltage control of logic blocks

Methods, systems, computer programs, etc., determine the required number of decoupling capacitors, and approximate locations for the decoupling capacitors, for a region of an integrated circuit. Switching elements of the region are entered into a simulation program running on a computerized device. Also, a power distribution model of the region is entered into the simulation program, and a power-supply voltage compression target is entered into the simulation program. These methods, systems, etc., generate an upper number of decoupling capacitors required to satisfy the compression target when all the switching elements concurrently switch. For each switching element, the methods, systems, etc., generate a specific number of decoupling capacitors required to satisfy the compression when only the element switches, calculate a fraction of the specific number to the upper number, assign the fraction of the total number of decoupling capacitors to each switching circuit element, and place the fraction of the total number of decoupling capacitors in electrical proximity to the element.

Early decoupling capacitor optimization method for hierarchical circuit design

A method of integrated circuit design and, more particularly, a method and system to optimize semiconductor products for power, performance, noise, die area, and cost through use of variable power supply voltage compression. The method is implemented in a computer-based tool and includes: embedding relationships in an optimization tool running on a computing device, wherein the relationships are based at least partly on performance, power-supply noise, die area, and power; inputting a set of product data and a set of technology data in the optimization tool running on the computing device; and determining product design parameters including power supply voltage, switching-noise-induced power supply voltage variation, and decap area. The determining is based on the relationships, the product data, and the technology data and is performed using the computing device running the optimization tool.

Method and system to optimize semiconductor products for power, performance, noise, and cost through use of variable power supply voltage compression

A method, system and computer program product for analyzing and modifying a static timing slack of a timing path in a static timing analysis of a design of an integrated circuit (IC) with a transient power supply are disclosed. A static timing slack analysis is performed at a selected endpoint in an IC to obtain a candidate timing path leading to the endpoint with a worst static timing slack. A transient static timing slack is determined for the candidate timing path for each clock cycle of a clock signal under the transient power supply. The determined transient static timing slack is used to adjust the timing of the IC and to modify the static timing slack of the candidate timing path.

Static timing slacks analysis and modification

In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

Method and apparatus for manufacturing diamond shaped chips

The invention provides a method for providing an integrated circuit () having a substantially uniform density between parts (and) of the IC that are non-orthogonally angled. In particular, the invention provides fill tiling patterns () oriented substantially parallel to electrical structure regardless of their angle. A method of electrical analysis based on this provision is also provided as is a related program product.

IC tiling pattern method, IC so formed and analysis method

Disclosed are embodiments of a method of designing and producing an integrated circuit. During the pre-release chip design process, the method subdivides the overall process window for an integrated circuit design into smaller successive intervals corresponding to achievable performance. Each performance interval is independently optimized for performance versus power by assigning to each interval a different corresponding supply voltage. Timing for the design is then closed for each interval at each assigned voltage. After chip manufacturing, the method measures the performance of the integrated circuits that are manufactured according to the design. Using these performance measurements, the circuits are sorted into bins corresponding to each performance interval and appropriately labeled (e.g., with the performance goal and previously assigned supply voltage corresponding to the performance interval).

Integrated circuit design closure method for selective voltage binning

A method for altering circuit characteristics to make them independent of processing parameters of devices within an integrated circuit is disclosed. A process parameter is measured by a kerf or on-chip built-in test on a selective set of chip on a wafer, and the results are stored on a storage device within each respective chip. Then, for each of the remaining chips, a two-dimensional interpolation is performed to determine the process parameter value for the respective chip based on the measured value. The interpolated values are recorded along with the coordinates of the chip in an efuse control file. Such information is subsequently stored into an efuse module within the chip. On-chip digital control structures are used to adjust certain operational characteristics of a functional component within the chip based on the information stored in the efuse module.

Method and apparatus for storing circuit calibration information

A method and a system for validating initial conditions (ICs) generally provided by a user when simulating a VLSI circuit are described. Inconsistent ICs sets are detected and replaced by consistent subsets thereof. The method selects the resistance and source values in a Norton or Thevenin circuit used to enforce the IC, and detects when specified ICs are inconsistent while preserving critical or fragile ICs when a two DC-pass approach is used. It further correlates the set of consistent ICs thus obtained with an equivalent circuit and simultaneously provides an input for future use. This allows a user to be notified and given a measure of how bad the inconsistencies are. Detecting inconsistencies is achieved either by measuring the holding current or by measuring the voltage drift if the two DC-pass approach is used.

Method for testing the validity of initial-condition statements in circuit simulation, and correcting inconsistencies thereof

A method for converting globally clock-gated circuits to locally clock-gated circuits is disclosed. A timing analysis is initially performed on an integrated circuit (IC) design to generate a slack time report for all globally clock-gated circuits within the IC design. Based on their respective slack time indicated in the slack time report, all globally clock-gated circuits that should be connected to locally generated clocks are identified. After disconnecting from a global clock tree, each of the identified globally clock-gated circuits is subsequently connected to a locally generated clock having a clock delay comparable to its slack time indicated in the slack time report.

Method and apparatus for converting globally clock-gated circuits to locally clock-gated circuits

A method of, and a system for, determining an extreme value of a voltage dependent parameter of an integrated circuit design is provided. The method includes determining a plurality of current waveforms, each of the plurality of waveforms corresponding to one of a plurality of aggressor objects in the design of the integrated circuit; applying each of the plurality of current waveforms to a subset of the plurality of power bus nodes, the subset of the plurality of power bus nodes being designed to supply power to a corresponding one of the plurality of aggressor objects; determining a plurality of voltage waveforms, each of the plurality of voltage waveforms being at one of the plurality of power bus nodes and corresponding to one of the plurality of current waveforms; using the plurality of voltage waveforms to determine the extreme value.

Voltage dependent parameter analysis

A method for designing an integrated circuit having multiple voltage domains, including: (a) generating a logical integrated circuit design from information contained in a high-level design file, the high-level design file defining global connection declarations and voltage domain connection declarations; (b) synthesizing the logical integrated circuit design into a synthesized integrated circuit design based upon the logical integrated circuit design, information in a preferred components file and information in a voltage domain definition file; (c) generating a noise model from the synthesized integrated circuit design based on information in the voltage domain definition file and a design constraint file; and (d) simulating the noise model against constraints in the design constraint file and constraints in a circuit level profile file to determine if the synthesized integrated circuit design meets predetermined noise simulation targets.

Method for designing an integrated circuit having multiple voltage domains

A structure and method for damping LC (inductance-capacitance) ringing in integrated circuit (IC) power distribution systems. The structure comprises a resistance electrically connected in parallel with a plurality of electrical switches. The resistance and electrical switches are electrically connected in series with the package and on-chip power distribution circuit. When on-chip switching activity creates a sudden and appreciable change in IC power demand the electrical switches are opened to temporarily increase the resistance in series with the power supply. This serves to dampen the power-distribution LC ringing. Later, the electrical switches are closed to shunt the series resistance and reduce the level of steady-state voltage drop in the power structure.

Damping of LC ringing in IC (integrated circuit) power distribution systems

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Shelburne, VT, United States of America

Ivan L Wemple