Epcos Ag

Tdk Electronics Ag

Ivan Jagust

Marion Ottlinger

Axel Pecina

Martin Galler

Robert Krumphals

Harald Kastl

Siegfried Fellner

Wolfgang Athenstaedt

Zeljko Maric

Peter Gerletz

Zdravko Mijocevic

A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.

Method for manufacturing multilayer components, and multilayer component

A multi-layer component () is specified, comprising a main body () with an external contact () arranged thereon, a further contact () for electrically contacting the multi-layer component (), and a connecting element () for connecting the external contact () and the further contact (), wherein the connecting element () is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact () from the external contact () is brought about.

Multi-layer component having an external contact

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Zagreb, Croatia

Ivan Jagust