Orbotech Limited

Itzhak Saki Hakim

Chay Goldenberg

Doron Sinai

Vered Gatt

Mordehay Amirim

Apparatus for inspecting electrical circuits including a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, the multiple lines being separated from each other by a separation distance along a scanning axis, each of the sensor pixels having a sensor pixel dimension along the scanning axis, a linear displacer providing mutual displacement of the TDI sensor and an electrical circuit to be inspected along the scanning axis and scanning optics directing light reflected from the electrical circuit to the sensor pixels, the scanning optics defining a projection of each sensor pixel onto the electrical circuit, which projection defines the area on the electrical circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection dimension along the scanning axis and an image generator constructing an image from composite output pixels of the TDI sensor.

Resampling with TDI sensors

A method for inspection of multiple features of patterned objects in the manufacture of electrical circuits, the method including performing defect detection on the patterned object, employing an optical defect detection machine (ODDM) and employing the ODDM to measure at least one of spatial coordinates and physical attributes of at least some of the multiple features.

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Kfar Saba, Israel

Itzhak Saki Hakim