Dainippon Screen Mfg. Co., Ltd.

Screen Holdings Co., Ltd.

Itsuki Kajino

Katsuhiko Miya

Akira Izumi

Hideki Adachi

Takashi Kawamura

Hiroyuki Ueno

Mikio Masuichi

Akihiro Hosokawa

Kazuhiro Shoji

Shuhei Nemoto

Kozo Terashima

Shoyo Minami

Masayuki Kataoka

A substrate supported on a substrate support is surrounded by a first contact member located at a first reference position, a second contact member located at a second reference position and a third contact member located at a third reference position in the horizontal plane. These three contact members gradually approach the substrate while keeping distances from a center of the substrate support equal by repeating the minute movements. The substrate posture is so adjusted that the direction of eccentricity is parallel to the virtual line prior to the start of the movements of the contact members. In the invention, the substrate posture is so adjusted that the direction of eccentricity is parallel to the virtual line prior to the above centering of the substrate.

Centering device, centering method and substrate processing apparatus

Force for biasing a roller member is changed according to the contact state of first and second plate-like bodies during the travel of the roller member. By that, the pressing force per unit area given from the second plate-like body to the first plate-like body during travel is suppressed. An object to be transferred is satisfactorily transferred despite a change in the contact state of the plate-like bodies during the travel of the roller member.

Transfer apparatus and transfer method

A plurality of through holes are provided between upstream ejection ports and downstream ejection ports. Thereby, when a rear end portion and therearound of a paper sheet is opposed to the downstream ejection ports, gas sucked to suction holes exposed at an upstream side of the paper sheet can be absorbed from the through holes. This can suppress an airflow occurring between a housing and the paper sheet. As a result, deviation of ink droplets ejected from the downstream ejection ports can be suppressed.

Image recording apparatus

Mutually different plural kinds of processing liquid are sequentially supplied to a gap space in which a substrate is arranged to perform a wet processing to the substrate with respect to each processing liquid. Further, the processing liquid used in the wet processing is sequentially released from the communicating portion upon execution of each wet processing. The liquid retrieval tanks are selectively positioned at a retrieval position corresponding to the kind of processing liquid released from the communicating portion by relatively moving the processing unit and the liquid retrieval unit. The liquid retrieval unit is separated from the processing unit and is arranged below the processing unit. The processing liquid is released from the communicating portion of the processing unit to below the gap space downwards vertically.

Substrate processing apparatus and substrate processing method

A substrate (W) is held and rotated in its horizontal position on a spin base (). A processing liquid can be supplied from a processing liquid lower nozzleto the lower surface of the substrate (W). The upper surface of the substrate (W) is covered with an atmosphere blocking plate (). A splash guard () is disposed so as to circumscribe the substrate (W). A guard () is curved such that the vertical cross section of a recovery port () of the splash guard () is of substantially U-shape opening to the center of the splash guard (), so that the maximum internal diameter part of the recovery port () is brought near a guard (). The space between the internal wall surface of the recovery port () and the substrate (W) is increased to thereby suppress the bounce of the processing liquid flying spattering from the substrate (W) in rotation.

Substrate processing apparatus

A substrate processing apparatus injects gas from an injection port formed on a shielding surface of an atmosphere shielding part and sucks a substrate by Bernoulli effect. The substrate is sucked in a state coming into contact with a contact supporting surface of a support member provided on the atmosphere shielding part, and rotated with the upper surface shielded by a shielding surface of the shielding part. A solution supply part supplies a chemical solution to the lower surface of the substrate. Therefore, mist of a processing solution or the processing solution can be reliably prevented from reaching the upper surface of the substrate. Thus provided is a substrate processing apparatus capable of reliably preventing the mist of the processing solution or the processing solution from reaching the upper surface of the substrate.

A support member of a rotary base member engages with a substrate for preventing the substrate from horizontal movement and rotation with respect to the rotary base member while allowing vertical movement of the substrate, and a proximity suction plate is provided above the rotary base member so that the lower surface thereof is formed on a plane on the rotary base member parallel to the substrate for downwardly and outwardly injecting gas toward the overall upper surface of the substrate and sucking the substrate in a proximity state by Bernoulli effect. It is possible to provide an apparatus capable of reliably preventing mist of a processing solution or the processing solution from reaching the upper surface of the substrate when rotating the substrate and supplying the processing solution to the lower surface for processing the substrate.

Growing community of inventors

Kyoto, Japan

Itsuki Kajino