Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Issei Yamamoto

Yoshihito Otsubo

Jun Adachi

Jun Urakawa

Akihiko Kamada

Atsushi Shimizu

Tadashi Nomura

Yosuke Matsushita

Hideo Nakagoshi

Kunihiro Miyahara

Yoichi Takagi

Yuta Morimoto

Yoshitaka Echikawa

Ikuo Deguchi

Norio Sakai

Toru Komatsu

Akio Katsube

Tetsuya Oda

Hideki Shinkai

Yuki Asano

Ryoichi Kita

Ryota Asai

Takuya Murayama

Yutaka Masuda

Kosuke Sugiura

Yoshihisa Masuda

Katsuki Nakanishi

Shigeru Endo

Yukio Nakazawa

Naoya Murakita

Atsunobu Okazaki

Yoshiki Tobita

Wiring board includes rigid board and flexible board laminated on rigid board. Cavity recessed in thickness direction of rigid board is formed in surface of rigid board which is located on flexible board side. Side surface and bottom surface of cavity are formed of rigid board. Top surface of cavity is formed of flexible board.

Wiring board and module

A wiring board includes at least one insulating layer, plurality of conductive members, at least one land electrode formed at position overlapping first surface in plan view of insulating layer as viewed from first surface side, land electrode being connected to each of at least one conductive member, and coil conductor provided inside insulating layer or on second surface on back side of first surface in insulating layer and having winding axis intersecting first surface. Plurality of conductive members includes first conductive member at position where at least part of the first conductive member overlaps opening of the coil conductor in plan view seen from first surface side, and second conductive member at position deviated from opening of coil conductor in plan view seen from first surface side. Area of first conductive member is smaller than area of second conductive member in plan view seen from first surface side.

Wiring board

A wiring substrate that is provided enables stray capacitance between a first electrode and a second electrode to be prevented from varying when an undulation occurs in the wiring substrate. Insulating layers are stacked. A first electrode and a second electrode are formed between the same layers at an interval. The thickness of the first electrode is more than the thickness of the second electrode. The lower main surface of the first electrode is located at a position lower than the lower main surface of the second electrode, and the upper main surface of the first electrode is located at a position higher than the upper main surface of the second electrode when seen through in a direction perpendicular to a stacking direction of the insulating layers.

Wiring substrate and electronic module

An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

Antenna-attached substrate and antenna module

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

Ceramic electronic component

A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.

Substrate with antenna, and antenna module

An electronic component module () includes a module board () having electronic components () mounted on at least one of a first surface (front surface) () and a second surface (back surface) (), mold portions (and), and a shield (). The mold portions (and) cover the mounted electronic components (). The shield () covers at least a part of the mold portions (and) and the side surfaces of the module board (). Protrusions () protruding from the side surfaces are formed on the module board (). The shield () is separated by the protrusions ().

Electronic component module and method for manufacturing electronic component module

Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminatein which substrate layerstoare laminated, having an outer surface including a first main surfaceB, a second main surfaceT, and a side surfaceS, internal electrodes (a ground electrodecoil electrodescapacitor electrodesand wiring electrodes), an external electrodeand a first plating layerformed on a surface of the external electrode

Laminated electronic component and method for manufacturing laminated electronic component

A substrate equipped with an antenna of the present disclosure includes a circuit substrate and an antenna element. When viewed from a thickness direction, an area of one principal surface of the circuit substrate is larger than that of another principal surface thereof, and each of the one principal surface and the other principal surface of the circuit substrate is formed in a rectangular shape. When a maximum width between a first outer periphery of the other principal surface projected onto the one principal surface and a first outer periphery of the one principal surface is defined as W, the antenna element is mounted in at least part of a region on the one principal surface of the circuit substrate, in which the region has the width Wfrom the second outer periphery of the other principal surface projected onto the one principal surface toward the inner side.

Substrate equipped with antenna and antenna module

A laminated substrate that includes a substrate body having a plurality of laminated ceramic layers containing a first glass; a wiring conductor within the substrate body and made from silver, copper, a silver alloy, or a copper alloy; and a thermal conductor within or on a main surface of the substrate body. The thermal conductor is at least one of (1) a thermal via penetrating a part of a first ceramic layer of the plurality of laminated ceramic layers in a thickness direction thereof, and (2) a heat spreader extending along a main surface of the first ceramic layer of the plurality of laminated ceramic layers. A first thermal conductivity of the thermal conductor is higher than a second thermal conductivity of the first ceramic layer, and the thermal conductor contains an insulating ceramic as a main material thereof, and further contains a second glass.

Laminated substrate

An antenna-mounted substrate includes a first patch antenna, a second patch antenna disposed to face one principal surface of the first patch antenna, and a ground electrode disposed to face the other principal surface of the first patch antenna, the antenna-mounted substrate further including an antenna holding layer holding the second patch antenna, an inter-antenna layer positioned between the first patch antenna and the second patch antenna, and a substrate layer positioned between the first patch antenna and the ground electrode, those three layers being positioned in the mentioned order, wherein the inter-antenna layer is made of a dielectric material, and a relation of &#x3b5;&#x3e;&#x3b5;&#x2265;&#x3b5;is satisfied on an assumption that a relative permittivity of the antenna holding layer is denoted by &#x3b5;, a relative permittivity of the inter-antenna layer is denoted by &#x3b5;, and a relative permittivity of the substrate layer is denoted by &#x3b5;.

Antenna-mounted substrate and antenna module

Provided is a stacked electronic component having: a stacked bodyin which ceramic layerstoare stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portionformed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodesformed between the layers of the stacked body; and a shield layerformed on the upper surface U and the side surfaces S of the stacked body. Right below an inner bottom surface of the recess portionof the stacked body, there is provided a no-electrode region NE in which the electrodesare not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion

Stacked electronic component and method for manufacturing stacked electronic component

A multilayer ceramic substrate according to the present disclosure has ceramic layers and a patterned conductor, and a cavity is formed in the multilayer ceramic substrate. The cavity reaches to any one of principal surfaces of the multilayer ceramic substrate and forms an opening, and the opening is covered with a sealing member at the principal surface of the multilayer ceramic substrate.

Multilayer ceramic substrate and method of manufacturing multilayer ceramic substrate

A module improves a heat-releasing effect and that can be stably mounted on a mother substrate or the like. The module includes: a first component mounted on one main surface of a wiring substrate and generates heat; second components mounted on the one main surface of the wiring substrate; a sealing resin layer that seals the first component and the second components so as not to cover a top surface of the first component; and heat-dissipating parts arranged on the top surface of the first component. The height of the highest positions of the heat-dissipating parts relative to the one main surface is less than or equal to the position of a highest surface out of a surface of the sealing resin layer that is on the opposite side from the surface of the sealing resin layer that faces the one main surface.

Module

A ceramic electronic component according to the present disclosure includes a ceramic insulator and conductor portions including inner conductors disposed inside the ceramic insulator and outer conductors disposed outside the ceramic insulator, wherein each conductor portion has a surface and a back surface opposite to the surface, and at least one of the conductor portions includes a flat portion in which the conductor thickness is constant, surface corner portions having a round-chamfered shape in the direction from the surface toward the back surface of the inner conductor or the outer conductor, and back surface corner portions having a round-chamfered shape in the direction from the back surface toward the surface of the inner conductor or the outer conductor.

Growing community of inventors

Kyoto, Japan

Issei Yamamoto