Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Nissan Chemical Industries Limited

Issei Okada

Kohei Shimoda

Yoshio Oka

Motohiko Sugiura

Takashi Kasuga

Kenji Ohki

Masatoshi Majima

Hiroshi Ueda

Kousuke Miura

Yasuhiro Okuda

Jinjoo Park

Tetsuya Kuwabara

Atsushi Kimura

Shinichi Maeda

Go Ono

Masahiro Yamakawa

Keiji Koyama

Kazuhiro Miyata

Hiroki Kakudo

A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 &#x3bc;m and less than or equal to 0.10 &#x3bc;m.

Base material for printed circuit board and printed circuit board

A method of manufacturing a copper nano-ink includes: a step of preparing a copper nanoparticle aqueous dispersion liquid including copper nanoparticles and anions; and a step of storing the copper nanoparticle aqueous dispersion liquid at 5&#xb0; C. or less after the step of preparing, wherein in the step of storing, a copper ion concentration of the copper nanoparticle aqueous dispersion liquid is controlled to be greater than or equal to 0.1 g/L and less than or equal to 1.0 g/L and an anion concentration is controlled to be greater than or equal to 0.5 g/L and less than or equal to 8.0 g/L.

Method of manufacturing copper nano-ink and copper nano-ink

According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr&#x3c;0.1 mg/m, and Ni&#x3c;0.1 mg/m, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 &#x3bc;m.

A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.

Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer

A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.

Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material

An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size Dof 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size Dof 20 nm or less as determined by an X-ray analysis, and a ratio (D/D) of the mean crystallite size Dto the mean particle size Dof less than 0.4.

Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

The present invention provides a metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein the metal coating comprises an alloy including (1) Ag and (2) at least one kind of metal selected from the group consisting of Au, Pt, Pd, Ru, Ir, Sn, Cu, Ni, Fe, Co, Ti and In, the content ratio of Ag being 80-99.9% by atomic percent in the total quantity of the alloy, and wherein the metal coating has an average grain size of 0.2-5 &#x3bc;m. The metal coating has small surface roughness, and superior smoothness and denseness, and has excellent properties for etching and adhesion to a base material. Also, the invention provides a method of forming such metal coating as well as a metal wiring formed by pattern formation of the metal coating.

Metal coating, forming method thereof, and metal wiring

An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200&#xb0; C. or lower which has no influence on the above-mentioned plastic substrate. The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200&#xb0; C. or lower to form an insulating layerhaving a contact angle with water of 80&#xb0; or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layerand heating the above-mentioned coating film at a temperature of 200&#xb0; C. or lower to form a conductive layer such as a source layeror a drain layer

Method for manufacturing electronic circuit component

When fine metal particles of a nanometer size are handled in a state of colloidal particles, it is difficult to handle them and the range of the selection of the solvent to be used is limited. The invention offers a granular metal powder that is produced by the steps of (a) preparing a suspension liquid comprising (a1) water, an organic solvent, or a mixture thereof, (a2) metal particles having an average particle diameter of at least 1 nm and at most 100 nm, and (a3) an organic compound capable of being adsorbed on the surface of the metal particles and (b) removing the water, organic solvent, or mixture thereof by drying the suspension liquid and that has an apparent density of at least 1.0 g/ml and at most 5.0 g/ml. The granular metal powder can be handled as a dry metal powder and is readily redispersed in a solvent.

Granular metal powder

A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000.

Metallic colloidal solution and inkjet-use metallic ink

A method of producing metal powder by reducing ions of a metal for precipitation by performance of a reducing agent in a liquid-phase reaction system, wherein the metal is precipitated as metal powder particles by being reduced under conditions in which the exchange-current density of an oxidation-reduction reaction between the metal ions and the reducing agent is 100 &#x3bc;A/cmor less, the exchange-current density being determined by the mixed potential theory.

Method of producing metal powder

A method of manufacturing the chain-structure metal powder comprises precipitating a metal powder by a reaction performed in an aqueous solution in which nickel ions, complex ions, and titanium ions containing trivalent titanium ions (Ti3+) and tetravalent titanium ions (Ti4+) are present.

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Osaka, Japan

Issei Okada