Senju Metal Industry Co., Ltd.

Issaku Sato

Akira Takaguchi

Naoki Sato

Noboru Hashimoto

Hideaki Tanibata

Junichi Okamura

Isamu Sato

Takashi Nauchi

Kenzo Tadokoro

Sinzo Nakamura

Toshio Hakuto

Kenzou Tadokoro

A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Wave soldering tank

Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection headfor supplying molten solder has a nozzlebrought into contact with a mask with openings that is disposed over a substrate. After completing a supply operation, the injection headis forcedly cooled by heat transfer from a cooling unitthrough a heater unitwhose operation has been stopped. Molten solderin the cooled injection headdoes not drool from the nozzlewhen the injection headmoves up.

Solder bump forming method and apparatus

An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.

Apparatus and method of coating flux

To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. As shown in FIG., an automatic partial-jet-soldering apparatusis provided with a solder baththat has a nozzle base portionand contains molten solder, a pumpthat supplies the molten soldercontained in the solder bathunder a predetermined pressure to the nozzle base portion, plural nozzlesand the like that have predetermined solder-spouting areas and connect the nozzle base portionto spout the molten soldersupplied from the pumpunder the predetermined pressure so that it rises by its surface tension, and a dummy nozzlethat has a solder-spouting area more than that of any of the nozzlesand the like and connects the nozzle base portionto spout the molten soldersupplied from the pumpunder the predetermined pressure, wherein the dummy nozzleis positioned on a position which is nearer the pumpthan the nozzlesand the like.

Localized jet soldering device and partial jet soldering method

To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. By flowing the molten solderin the solder bathfrom inside of the inner cylinderto a nozzle cap, the inside of the nozzle capis filled with the molten solder, and the molten solderfilling the inside of the nozzle capis flown downward from between an inner cylinderand an outer cylinderwithout substantially flowing it to outside from an insert hole. This enables the molten solderto be prevented from oxidizing because the molten solderis not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzlewithout filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a leadof electronic componentbeing inserted into the insert hole, it is possible to fill the through hole of the printed circuit board P with the molten solder, so that the reliability can be improved.

Point flow soldering apparatus

A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200&#xb0; C. is made to penetrate into a porous portion comprising a Cu&#x2014;Sn based alloy. A Bi&#x2014;Sn based alloy or a Bi&#x2014;In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.

Sliding material and a method for its manufacture

A multi-layer sliding part is prepared by a process including mixing 1&#x2013;50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5&#x2013;20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a metal backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate. After sintering of the pulverized powder to form bearing metal layer, the bearing metal layer is pressed and densified. After densification, the bearing metal layer is annealed, again pressed, and then coated with a resin having good sliding properties.

Multi-layer sliding part and a method for its manufacture

A multi-layer sliding part is prepared by a process including mixing 1&#x2013;50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5&#x2013;20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a steel backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate.

A lead-free journal bearing includes a cylindrical ferrous backing and a bearing alloy layer comprising a bearing alloy powder consisting essentially of 7-13 mass percent of Sn, 0.7-2 mass percent of Ag, optionally at most 0.5 mass percent of molybdenum disulfide, optionally at most 2 mass percent of graphite, and a remainder of Cu sintered to an inner surface of the backing. The bearing is particularly suitable for use in construction equipment.

Lead-free journal bearing

A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 &mgr;m Ra and then fine finished by polishing to a roughness of at most 0.1 &mgr;Ra.

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Tokyo, Japan

Issaku Sato