Insightec, Ltd.

Other

Cerel (Ceramics Technologies) Ltd.

Lumenis Be Ltd.

Israel Schuster

Yoav Levy

Oleg Prus

Lior Greenbaum

Shahar Rinott

Nissim Cohen

Ludmila Cherniak

Tali Peled

Danny Koifman

Andrey Gandmann

Various approaches for computationally characterizing tissue in an anatomic target region include generating multiple sonications to transient acoustic reflectors at or proximate to the target region; measuring reflection signals of the sonications off the transient acoustic reflectors; based on the measurements, identifying the reflection signals originating from single transient acoustic reflectors; and based at least in part on the identified reflection signals, generating a digital map including a tissue characteristic.

Systems and methods for providing tissue information in an anatomic target region using acoustic reflectors

Systems and methods for treating target tissue include generating a priming sequence of sonication pulses for delivering acoustic energy to the target tissue; pausing generation of the sonication pulses for a delay interval; and generating a series of treatment sequences of sonication pulses for delivering acoustic energy to the target tissue, the treatment sequences having sonication intervals therebetween and the delay interval being larger than the largest sonication interval by a predetermined factor.

Pre-treatment tissue sensitization for focused ultrasound procedures

The present invention provides a process for manufacturing a porous metal electrode, wherein the porosity degree is in the range of 30 to 50% and the metal is capable of forming a stable, uniform, oxide layer having a dielectric constant greater than 25 (k&#x2267;25), preferably selected from the group consisting of tantalum and niobium, comprising a substantially uniform porous layer of deposited said metal particles thereon. The present invention further relates to a stable suspension for electrophoretically homogeneously deposition of said metal.

Process for manufacturing a metal electrode

The substrate () containing the via-hole () is inserted into an electrophoretic cell () and an electrode () (the 'first electrode') is placed on top of a first orifice of the via-hole(s) (), to be implemented with electrical component(s), so that the electrode () totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) () in a conductive medium () consisting of the electrically charged particles. An electric field is created between the first electrode () and a second electrode () through the via-hole(s) () and the conductive medium () and the electrically charged particles are precipitated on the inner surface of the first electrode () that is directed to the second orifice of the via-hole(s) (), until a desired portion of the volume of the via-hole(s) () is filled with a first layer of the charged particles having a desired thickness. More layers may be created by repeating this process using additional electophoretic cell(s), until remaining portion of the volume of the via-hole(s) () is filled with the additional charged particles.

Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module

Growing community of inventors

Kiryat Tivon, Israel

Israel Schuster