Valeo Systemes Thermiques

Ismaël Franco

Stéphane De Souza

Clémence Kwaczewski

Zhenxia Ma

Biagio Provinzano

Iliass Laaiouni

Onur Tas

Johan Kaes

Mickaia Rabenja

The invention relates to a heat sink for an electronic board of a motor vehicle motor-driven fan unit, comprising a surface () intended for exchanging heat with an air flow set in motion by the motor-driven fan unit, referred to as exchange surface (), said exchange surface () comprising a planar portion () arranged so that, in a position installed in the motor-driven fan unit, the air flow set in motion by the motor-driven fan unit flows substantially parallel to said planar portion (), the exchange surface () also comprising a set of blind recesses () flush with said planar portion ().

Heat sink for an electronic board of a motor vehicle motor-driven fan unit

Disclosed is an assembly () of an electronic board () and a heat sink (), in particular for a motor-fan unit () of a motor vehicle, comprising an electronic board (); a heat sink () comprising a plate () fastened to the electronic board (), the surface of which has through-openings (); and a thermal paste () arranged between the electronic board () and the plate ().

Assembly of an electronic board and a heat sink, and motor-fan unit comprising such an assembly

The invention relates to an assembly for an electric motor, comprising a motor support (), a brush () and a device for moving () the brush (), the device comprising an arm () rigidly connected to the brush () and a pivot connector () between the support () and the arm (), characterised in that the pivot connector () is made from an elastomeric material so as to exert a restoring force on the arm ().

Assembly for a motor vehicle blower

The invention relates to a heat dissipation device comprising a support () and a heat sink () designed to be cooled by an air flow passing through the sink (), the support () having a first housing inside which the sink () is held, the support () being further configured to accommodate an electronic control module () designed to be cooled by the sink ().

Heat dissipation device, particularly for a device for generating an air flow

The invention concerns the transmission of synchronous data between a master communication module and a slave communication module via a serial data bus, in particular a SPI bus. According to the invention, the data to be transmitted by each of the two master and slave communication modules are encapsulated in a data field () of at least one frame further comprising a frame identifier (), and two frames are exchanged simultaneously between the two master and slave communication modules according to at least one predefined sequencing corresponding to a unique pairing of the identifiers of the two frames exchanged simultaneously. The integrity of a communication can therefore be controlled by verifying the sequencing of the exchanged frames.

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Les Clayes-sous-Bois, France

Ismaël Franco