Citizen Watch Company, Ltd.

Citizen Tokei Kabushiki Kaisha

Sayama Seimitsu Kogyo Kabushiki Kaisha

Citizen Electronics Co., Ltd.

Nippon Eurotec Kabushiki Kaisha

Isao Yabe

Yoshihiro Shimada

Katsuji Komatsu

Shingo Ichikawa

Yoshihiro Ishida

Seiichi Mimura

Kikuo Takenouchi

Hiroyuki Kaneko

Toshibumi Wakayama

Akira Yanagisawa

Kazuo Sato

Minoru Fukuda

Masao Mafune

Hiroshi Mabuchi

Hajime Omata

Kazuhiko Asaumi

Katsuhiko Ikai

Hiroaki Shimizu

Teruo Nayuki

Kazumi Machida

Masahiko Yoneyama

Takashi Odaka

Adapter for hearing aid

Hearing aid

Method of resin-sealing semiconductor device

Storage and safety device for article being stored

A method for manufacturing a substrate for an IC card in which, after a synthetic resin is filled into a cavity in an IC card substrate forming mold, or after a core pin for forming an IC module housing recessed section in the cavity in an IC card substrate forming mold is caused to project as far as an intermediate position, and the synthetic resin is filled into the cavity, the core pin is further caused to project to a specified position to form the IC module housing recessed section while the synthetic resin is in the mobile state.

Method for manufacturing IC card substrate

A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Resin encapsulated semiconductor device

Resin encapsulated pin grid array and method of manufacturing the same

A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Method of making a resin encapsulated pin grid array with integral

A molded part formed by outsert-molding a resin into a through hole of a pipe part includes a pipe part and a resin part. The pipe part includes a hole having a tapered surface whose size is gradually reduced inward from an end portion of a through hole formed in an outsert-molded part such as a metal part, and a resin part has an outer shape matching the tapered surface. The resin part is formed in the pipe part by outsert molding.

Molded part and mold for manufacturing the same

A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

An IC card includes an IC module and a card base. The IC module is constituted by a circuit board having contact patterns formed thereon and an IC chip mounted on the circuit board. The card base houses the IC module so as to expose the contact patterns. The circuit board of the IC module is constituted by a pattern portion on which the contact patterns are formed and bent portions formed by bending the pattern portion. The card base includes an opening for exposing the contact patterns of the IC module, and clamping portions, formed on peripheral portions of the opening, for fixing the bent portions. The bent portions of the IC module are fixedly clamped by the clamping portions such that the contact patterns are arranged on substantially the same plane as a surface of the card base.

IC card

A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.

Resin encapsulating method

A receiving unit for timepieces, especially an improved receiving unit for a self-winding mechanism of self-winding timepieces. The receiving unit comprises guide portions and springs which are formed together as a unitary structure using resin.

Receiving unit for timepieces

Growing community of inventors

Tokorozawa, Japan

Isao Yabe