Fujitsu Corporation

Isao Watanabe

Eiji Horikoshi

Motoaki Tani

Katsuhide Natori

Makoto Usui

Takashi Ito

Tsutomu Miyashita

Hiroshi Horiuchi

Makoto Sasaki

Hiroaki Date

Masami Tsutsumi

Shoichi Miyahara

Yuko Hozumi

Osamu Taniguchi

Seiki Sakuyama

Norio Sawatari

Hiroki Uchida

Takehiko Sato

Tamotsu Yamamoto

Kaoru Hashimoto

Kazumasa Saito

Koji Katsuyama

Isao Kawamura

Takeshi Nagai

Haruhiko Yamamoto

Seiji Okada

Toshiaki Narusawa

Kensuke Yoshida

Hirofumi Okuyama

Katsura Adachi

Karuhiko Yamamoto

Motaki Tani

Usui,makoto

The conductive material comprises a first metal material having a melting point of not more than 250&#xb0; C. and a second metal material having a melting point of not less than 500&#xb0; C., and is paste at a temperature not more than 250&#xb0; C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Conductive material and method for filling via-hole

A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used. A MC-type conductive filler may also be made by immersing minute metallic particles in an affinity agent, immersing and dispersing the affinity agent treated-particles in an epoxy monomer and polymerizing the monomer to form an insulating polymer on the surface of the minute metallic particles.

Microcapsulating conductive metal particles with polymerized monomers

A lithium secondary battery includes a cathode which can be dischargeably charged with lithium ions, an anode made of lithium metal, a lithium alloy or any other anode material which can be releasably doped with lithium ions, and an electrolyte which allows migration of lithium ions between both electrodes. The cathode contains a halogen compound which releases halogen atoms, halogen ions or a reactive halogen-containing substance for reacting with the anode, thereby deactivating the anode to prevent excessive heat generation before oxygen released from the cathode due to a temperature rise reacts with the anode.

Lithium secondary battery and cathode composition therefor

A lithium secondary battery includes a cathode which can be dischargeably charged with lithium ions, an anode made of lithium metal, a lithium alloy or any other anode material which can be releasably doped with lithium ions, an electrolyte which allows migration of lithium ions between both electrodes, and an endothermic substance which undergoes an endothermic reaction upon a temperature rise of the battery for preventing excessive heat generation. Typically, the endothermic substance is a metal carbonate such as magnesium carbonate, cobalt (II) carbonate, silver carbonate, cadmium carbonate or sodium hydrogencarbonate.

Method for production of microcapsule type conductive filler

The film forming, photosensitive, heat-resistant resin composition comprising a varnish of a polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized, and a polymerization initiator for said monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting including multi-chip modules or the like, such as printed circuits, printed boards, wiring boards and electronic components, since it can effectively avoid a reduction of the layer thickness during the film formation, and ensures a low cost production process. The pattern formation process using the such resin composition is also disclosed.

Photosensitive, heat-resistant resin composition for forming patterns

A method for forming a photosensitive, heat-resistant resin composition film including the step of coating a base material with a varnish made up of a polyimide precursor having no photosensitivity, a photopolymerizable monomer or oligomer capable of providing a high-heat-resistant polymer upon being polymerized, and a polymerization initiator for the monomer or oligomer. The coating is exposed to a light pattern to polymerize the monomer or oligomer in a pattern. The remaining coating is selectively removed from the non-patterned areas. The patterned coating is heat treated to cure the polyimide precursor, thereby forming the film.

Process for using photosensitive, heat-resistant resin composition to

A film forming, photosensitive, heat-resistant resin composition including a varnish of a polyimide precursor having no photosensitivity in itself, a polymeriziable monomer or oligomer compatible with the varnish and capable of providing a high-heat-resistant polymer upon being polymerized, and a polymerization initiator for the monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting, since it can effectively avoid a reduction of the layer thickness during film formation, and ensures a low cost production process. The pattern formation process using such a resin composition is also disclosed. The polymeric composite having a particles-in-matrix microstructure and the production process thereof are also disclosed.

Photosensitive, heat-resistant resin composition and process for using

In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.

Process and apparatus and panel heater for soldering electronic

An electrolytic solution for a lithium secondary battery is provided, which comprises: an electrolyte; an organic solvent; and an additive, wherein the additive is an aromatic nitrogen-containing heterocyclic compound such as pyrazine, quinoxaline, indole, phenazine, phthalazine, pyrimidine, or a mixture thereof.

Electrolytic solution for lithium secondary battery and lithium

In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit board, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit board with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.

Process and apparatus for soldering electronic components to printed

A circuit board comprising a core material made from magnesium, a magnesium alloy, or a magnesium-based composite material, and an electric circuit formed on the core material. A process for producing the circuit board comprises the steps of (1) forming an electrodeposition-painted coating on such a core material, (2) forming a polyimide resin coating on the electrodeposition-painted coating, (3) forming a via hole extending through the resin coating to the underlying electrodeposition-painted coating, (4) etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the via hole while masking the other region with the resin coating thereby extending the via hole to the core material, (5) forming a metal film on at least a free surface of the resin coating and an inner surface of the extended via hole, and (6) etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern.

Circuit board and process for producing same

A circuit board comprising: a core material made from magnesium, a magnesium alloy, or a magnesium-based composite material, and an electric circuit formed on the core material. A process for producing the circuit board comprises the steps of (1) forming an electrodeposition-painted coating on such a core material, (2) forming a polyimide resin coating on the electrodeposition-painted coating, (3) forming a via hole extending through the resin coating to the underlying electrodeposition-painted coating, (4) etching and removing the electrodeposition-painted coating in the region exposed in the bottom of the via hole while masking the other region with the resin coating thereby extending the via hole to the core material, (5) forming a metal film on at least a free surface of the resin coating and an inner surface of the extended via hole, and (6) etching the metal film by using a photoresist mask to form a conductor layer having a predetermined pattern.

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Kawasaki, Japan

Isao Watanabe