The Furukawa Electric Co., Ltd.

Other

Furukawa Magnet Wire Co., Ltd.

Essex Furukawa Magnet Wire Japan Co., Ltd.

Isao Tomomatsu

Takahiro Ueno

Masayuki Ishiwa

Yukihiro Ikura

Hiroki Tanaka

Yasuo Nakajima

Takanori Washiro

Minoru Saito

Kenichi Suyama

Jae Kyung Kim

Hiroki Hamada

Suzune Ito

Shinji Satoh

Hideo Fukuda

Toshiyuki Imagawa

Minoru Oozeki

Mayu Satake

Makoto Oya

Daisuke Muto

Tsuneo Aoi

Yoshikazu Kamei

Jirou Hiroishi

Satoko Yamoto

Motoko Yoshizaki

Makiko Nakano

Yousuke Kokubo

Mitsuo Yoshino

Yoichiro Negishi

Xiao Chuan Zhu

An organic fiber-reinforced resin formed body that contains a resin and a cellulose fiber, wherein the resin formed body has a density of 0.65 g/cmor less, and a method for producing the same.

Organic fiber-reinforced resin formed body and method for producing the same

A cellulose fiber-reinforced polypropylene resin formed body that is a resin formed body having respective diffraction peaks observed at positions of a scattering vector s of 1.61±0.1 nm, 1.92±0.1 nm, and 3.86±0.1 nmin a wide-angle X-ray diffraction measurement, and is characterized by having ΔT calculated by the following formula (1) of 40.0° C. or more; and a cellulose fiber-reinforced polypropylene resin formed body that is a resin formed body having the above diffraction peaks and is characterized by having ΔTand ΔTexpressed by the following formulae (2) and (3) and satisfying ΔT<ΔT; and a producing method of these.Δ  (1)Δ  (2)Δ  (3)

Cellulose fiber-reinforced polypropylene resin formed body and method for producing the same

A resin formed body obtained from a resin composition that contains a polypropylene resin and a cellulose fiber, the polypropylene resin partially containing an acid modified polypropylene resin,

Resin formed body and resin composition

A laminated body, containing a fiber-reinforced resin, in which a fiber-reinforced thermoplastic resin layer () containing fiber bundle of reinforcing fibers and a first thermoplastic resin, and a resin layer () containing a second thermoplastic resin, are alternately laminated, to form the fiber-reinforced resin, and the ratio of the indentation elastic modulus Eof the first thermoplastic resin portion of the laminated body with respect to the indentation elastic modulus Eof the second thermoplastic resin is 1.5 or more and 5.0 or less;

Laminated body containing fiber-reinforced resin, fiber-reinforced composite resin material and methods of producing these

Insulated wire, coil, and electrical or electronic equipment

An insulated wire having a thermosetting resin layer on the outer periphery of a conductor and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer, wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 &#x3bc;m or more and 250 &#x3bc;m or less, and a degree of orientation of a thermoplastic resin in said thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less; a coil and an electric and electronic equipment each having the insulated wire. Formula 1 Degree of orientation H (%)=[(360&#x2212;&#x3a3;W)/360]&#xd7;100 W: A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction n: the number of orientation peak at a &#x3b2; angle of 0&#xb0; or more and 360&#xb0; or less.

Insulated wire, coil, and electric or electronic equipment

A small antenna comprises an antenna conductor, and a dielectric chip formed at surroundings of the antenna conductor by a plurality of resin moldings.

Small antenna and manufacturing method thereof

A line-shaped comprises an antenna element in which a strip-shaped conductor is bent in a width direction of a strip, and a chamfered portion is provided on an outer edge of a bent portion of the strip-shaped conductor.

Line-shaped antenna

Of margins of a resin molding with an antenna element buried therein which lie around the antenna element, a margin on that side of the resin molding where a gate mark remains is made larger than margins on other sides where there is no gate mark. Particularly, when the antenna element has a line antenna portion and a capacitance-adding portion provided at a distal end of the line antenna portion, the resin molding is injection-molded in such a way that a gate mark can be formed on that side where the capacitance-adding portion is located. Those portions of the resin molding where the terminal portions are led out are dented from levels of portions around those portions. This provides a chip antenna which has a simple structure with a high mechanical strength and does not prevent separation or cracking from occurring in the resin molding in which the antenna element is buried and a method of manufacturing the chip antenna.

Chip antenna and method of manufacturing the same

An antenna apparatus comprises a substrate, a chip antenna mounted on the substrate, and a ground pattern disposed on the substrate, at least a portion on the side of a power supply terminal of an antenna conductor in the chip antenna being overlapped with the ground pattern.

Antenna apparatus

A dielectric ceramic containing Bi, Zn, and Sr as constituent elements. A resin-ceramic composite material containing a mixture of the dielectric ceramic powder and an organic polymer resin. An antenna and an electrical part using the composite material, and a manufacturing method thereof.

Dielectric ceramic, resin-ceramic composite material, electrical part and antenna, and manufacturing method thereof

A chip antenna comprises an antenna conductor, and a dielectric chip which stacks on a portion of the antenna conductor, in which a conductor exposed portion of the antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.

Chip antenna and manufacturing method of the same

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Tokyo, Japan

Isao Tomomatsu