Tokyo Ohka Kogyo Co., Ltd.

Isao Tateno

Yasuaki Sugimoto

Masaru Shida

Hiroyuki Ohnishi

A positive photosensitive resin composition with favorable heat resistance and transparency is provided. The photosensitive resin composition contains a resin component (A1) having a structural unit (a1') obtained by substituting at least a portion of hydrogen atoms of phenolic hydroxyl groups within a structural unit represented by a general formula (a1) shown below with a naphthoquinone-1,2-diazide-5-(and/or -4-) sulfonyl group. (In the above general formula, Rrepresents a hydrogen atom or methyl group, Rrepresents a single bond or an alkylene group of 1 to 5 carbon atoms, Rrepresents an alkyl group of 1 to 5 carbon atoms, a represents an integer from 1 to 5, b represents either 0 or an integer from 1 to 4, and a+b is no greater than 5. If two or more Rgroups exist, then these Rgroups may be either the same or mutually different.)

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Kawasaki, Japan

Isao Tateno