Denki Kagaku Kogyo Kabushiki Kaisha

Isao Sugimoto

Takashi Kawasaki

Hideyuki Emoto

Yoshitaka Taniguchi

Akira Miyai

Masahiro Ibukiyama

Takeshi Gotoh

Nobuyuki Yoshino

Motoharu Fukazawa

Yutaka Hirashima

Katsunori Terano

Manabu Uto

Yasuhito Hushii

Syoji Takakura

Yoshihiko Tujimura

Kouji Miyata

The present invention is to provide hollow particles with a low degree of agglomeration and having a high roundness, and a process for producing them. Hollow particles comprising a silicon compound, having an average particle size of from 5 to 65 nm and an average roundness of at least 0.90, and having a shell comprising the silicon compound and having a thickness of from 1 to 20 nm. Further, a method for producing hollow particles, which comprises adding sulfuric acid to a liquid containing spherical organic polymer-silicon compound composite particles having a core comprising an organic polymer and a shell comprising a silicon compound in a medium containing at least 95 mass % of water, followed by heating to carbonize the organic polymer thereby to convert it to a carbide, and subjecting the carbide to decomposition using a liquid oxidizing agent other than sulfuric acid.

Spherical organic polymer-silicon compound composite particles, hollow particles and their production methods

A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 &#x3bc;m or more and 1,200 &#x3bc;m or less.

Module structure and module comprising it

A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu.

Circuit substrate

Growing community of inventors

Omuta, Japan

Isao Sugimoto