Hitachi, Ltd.

Isao Sakama

Minoru Ashizawa

Hidehiko Kando

Keizo Watanabe

Nobuhiro Kudo

Shimpei Hesaki

Koichi Tachibana

An RFID tag prevents reduction of communication characteristics due to mutual interference of RFID tags and enables to collectively read plural densely arranged RFID tags by a reader apparatus even when the plural RFID tags are in a densely arranged state. The RFID tag of the present invention is an RFID tag having an IC chip and a first antenna connected to the IC chip, provided with an impedance matching circuit for performing impedance matching between the IC chip and the first antenna, and arranged by stacking a conductor to cover the impedance matching circuit via an insulator base material.

RFID tag and method of manufacturing the same

An RFID tag includes a first antenna on which an IC chip is mounted and a second antenna extending from an end of the first antenna in a direction at right angles to the first antenna. The first antenna has an arbitrarily electrical length and the second antenna has an electrical length of &#x3bb;/2 or an integral multiple of &#x3bb;/2. A resin base film having a thickness of approximately 50 &#x3bc;m is disposed on the back side of the first antenna and the second antenna. With this configuration of a tag antenna, the second antenna resonates with the first antenna to exhibit a radio wave amplifying effect. Therefore, a long communication distance can be achieved even if the electrical length of the first antenna is chosen to be short or the thickness of the base film is chosen to be thin.

RFID tag located on metallic surfaces that have an increased communication range

A micro-strip antenna includes two conductors. One of the conductors is a radiation electrode including a first radiation electrode including an IC chip and a slit and a U-shaped second radiation electrode. The antenna further includes an opening and a cutout formed by the first and second radiation electrodes and a radiation electrode.

Radio frequency IC tag

An RFID thread which is mounted on a sheet and whose predetermined information can be read wirelessly from outside, the RFID thread includes: an IC chip recording the predetermined information; a first antenna consisting of an electrically continuous conductor which has a length corresponding to a size of the sheet and on which one or a plurality of the IC chips are mounted; and a base film made of resin for supporting the first antenna.

RFID thread, sheet with RFID thread, and printing machine for sheet with RFID thread

An RFID tag having mounted thereon an IC chip capable of receiving and delivering information from and to an external source without contact. In the RFID tag, a central axis of its own antenna having mounted thereon the IC chip coincides with a center of the RFID tag, and an antenna width is controlled. That is, a position of the central axis of the antenna is controlled to correct the mass eccentricity of the RFID tag. Further, the RFID tag is an RFID tag having mounted thereon the IC chip capable of receiving and delivering information from and to an external source without contact, and an RFID tag having attached thereon the IC chip at a position in which a first and a second antenna lengths are different from each other.

Radio frequency identification tag

An RFID tag mounting circuit board has a configuration in which an RFIC chip, a minimum antenna, a circuit which matches the impedance of the RFIC chip and that of the antenna are mounted on a printed circuit board. With this configuration, the area occupied by the antenna of an RFID tag is suppressed, and a decrease in the component mounting density of the printed circuit board is also suppressed. The RFID tag mounting circuit board is configured to be capable of managing the histories of all components on a per-printed-circuit-board basis by attaching a reading device for an RFIC chip to a chip mounter which mounts an IC chip.

RFID tag mounting circuit board

In an RFID tag mounting package mounted with an RFID tag and a manufacturing method thereof, in order to have sufficient communication performance without spoiling the design property of the package to which a conductive film is applied, a package is obtained by assembling a structural material in which a metallic film is formed on a base material made of paper or the like. In the package, a slot is provided in the metallic film of a folded portion, in a spot where portions (the folded portion and an external packaging portion) of the structural material overlap each other. An inlet operates as an RFID tag, includes an antenna and an IC chip connected to the antenna, and is mounted on the inner surface of the folded portion in conformity with the position of the slot.

RFID tag mounting package and manufacturing method thereof

A wireless IC tag includes an IC chip with a response circuit for receiving a signal sent from an interrogator and transmitting a response signal in response to the received signal, a rectangular antenna connected to the response circuit, a first protective material hard in nature for covering the IC chip, and a second protective material, softer than the first protective material, for covering at least a part of the antenna, and the antenna is formed in a laminated structure of a plurality of flat members different in toughness so as not to fracture even when the antenna is bent by external forces.

Method for manufacturing radio frequency IC tag and antenna

An IC tag mounting at least two IC chips operating in different frequency bands. The IC tag having a first inlet including a first antenna having a relatively long operation wavelength and a first IC chip mounted on the first antenna, and a second inlet including a second antenna having an operation wavelength shorter than the first antenna and disposed crossing at a predetermined angle over a line of the first antenna without positioning both opposite ends of the second antenna upon the first antenna and a second IC chip mounted on the second antenna. The second antenna has a matching circuit for impedance matching between the second antenna and the second IC chip. The matching circuit is a slit formed in the second antenna and positioned upon terminals of the second IC chip. Thus, the second antenna is made compact using the first antenna as an auxiliary antenna.

IC tag and inlet for IC tag

The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip which is fabricated on the wafer by the mask shift method and mask combination method.

Semiconductor apparatus and method for manufacturing the same

A RFID tag read equipment includes a read device and an antenna system including first to third antennas. The read device outputs the question wave as a high-frequency current, and reads the predetermined data by demodulating the answer wave when the answer wave is inputted therein as a high-frequency current. The first to third antennas output the high-frequency current when they receive the electromagnetic wave, and radiate the electromagnetic wave when the high-frequency current is inputted therein. Here, the first antenna is connected to the read device via a feeder wire, the second antenna being located such that its radiation direction is made parallel and opposite to radiation direction of the first antenna, the third antenna being connected to the second antenna via a feeder wire.

RFID tag read system and method of reading RFID tag

The RFID tag is composed of the first antenna of metal film layer on which the IC chip is mounted and at least one second antenna of metal film layer on which the IC chip is not mounted The metal film layer is formed on the base, and the metal film layer is formed on the base. The metal film layer partially overlaps the metal film layer with the base interposed between them, so that the first antenna and the second antenna are capacitively coupled to each other.

IC tag and method for fabricating the same

A connector device used for electrical connection between electrical devices, including: a first connector; an IC chip disposed in a casing of the first connector; a first antenna disposed in the casing of the first connector, for wirelessly transmitting ID data of the IC chip stored in the IC chip in response to a signal from an external device; a second connector detachable from the first connector, electrically connecting the electrical devices when coupled to the first connector; and a second antenna disposed in a casing of the second connector, brought close to the first antenna to amplify and transmit a radio wave from the first antenna, when the first and second connectors are normally coupled together.

Connector device, apparatus and method for acquiring data of electrical device using the connector device, and control system for electrical device

A tablet PTP package contains a multiplicity of tablets by a resin PVC and a metal sheet such as an aluminum sheet. An elongate space pattern is formed in a part of the aluminum sheet on the lower surface of the package to form an island area constituting an antenna. A small radio IC inlet including an IC chip mounted on a small antenna is arranged on the reverse surface (upper surface of the package) of the portion of the aluminum sheet corresponding to the island area. The small radio IC inlet and the second antenna formed by the island area are electrostatically coupled to each other with the resin PVC as a dielectric member, and thus a RFID (radio frequency identification) tag is configured.

Radio frequency identification tag and manufacturing method thereof

To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surfaceand a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.

Growing community of inventors

Hiratsuka, Japan

Isao Sakama