Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Isao Ozawa

Manabu Matsumoto

Katsuya Murakami

Koichi Nagai

Akira Tanimoto

Yasuo Kudo

Isao Maeda

Satoru Fukuchi

Shinji Honjo

Shinya Watanabe

Tetsuya Sato

Takashi Oshima

Toyokazu Eguchi

Toshitsune Iijima

Yasuo Takemoto

Yuji Karakane

Takakatsu Moriai

Takeshi Kusakabe

Akihito Ishimura

Yasuyuki Nagahara

Yohichi Ohta

Tadashi Shimazaki

A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding vires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.

Semiconductor device with sealed semiconductor chip

A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.

According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals

A semiconductor device package includes a substrate including, on an edge thereof, a connector that is connectable to a host, a nonvolatile semiconductor memory device disposed on a surface of the substrate, a memory controller disposed on the surface of the substrate, an oscillator disposed on the surface of the substrate and electrically connected to the memory controller, and a seal member sealing the nonvolatile semiconductor memory device, the memory controller, and the oscillator on the surface of the substrate.

Semiconductor device package having an oscillator and an apparatus having the same

According to one embodiment, a semiconductor package includes a substrate with first and second pad, first semiconductor chip above the substrate, first wire, first mold member, second semiconductor chip above the first mold member, third semiconductor chip above the second semiconductor chip, second wire, and a second mold member. The first wire electrically connects the first pad and the first semiconductor chip. The first mold member seals the first wire and the first semiconductor chip. The second wire electrically connects the second pad and the second semiconductor chip. The second mold member seals the second wire, the second and the third semiconductor chips, and the first mold member.

Semiconductor package

A semiconductor device includes a printed circuit board having a first surface and a second surface on a side opposite to the first surface. First pads are on the first surface of the printed circuit board. An interface part is mounted on the printed circuit board via the first pads and is configured to transfer a signal between the interface part and a host device. Second pads are also on the first surface and insulated from the interface part. A semiconductor memory and a controller are mounted on the first surface. First solder balls electrically connect the first pads and the controller. Second solder balls electrical connect the second pads and the controller. A plurality of third pads are disposed on the second surface and electrically connected to the second pads allowing direct connections to the controller and memory via the second pads.

Semiconductor device

Semiconductor device and semiconductor package

According to one embodiment, a data storage device includes a controller driven by a first power supply voltage, a nonvolatile memory controlled by the controller and driven by a second power supply voltage, and a switch element determining whether the second power supply voltage is applied to the nonvolatile memory. The controller is configured to turn off the switch element in a first mode and turn on the switch element in a second mode.

Data storage device with nonvolatile memory

Data storage device including nonvolatile memory in which on/off state of power source voltage is controlled

Substrate for an electronic circuit

A semiconductor device includes a substrate, a semiconductor memory unit mounted on a surface of the substrate, a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, and a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.

Semiconductor device having a sealing layer covering a semiconductor memory unit and a memory controller

Growing community of inventors

Chigasaki, Japan

Isao Ozawa