Jsr Corporation

Kajima Corporation

Symyx Technologies, Inc.

Other

Isao Nishimura

Mitsuo Sakamoto

Yong Wang

Nobuo Bessho

Kenji Yamada

Atsushi Kumano

Katsuyasu Sasaki

Dominique Charmot

Kenji Okamoto

Masayoshi Suzuki

Eiichi Kobayashi

Yukio Nishimura

Adam Luke Safir

Tsutomu Shimokawa

Han-Ting Chang

Koji Ishii

Masayuki Endo

Didier G Benoit

Jun Tagami

Norihide Koshika

Hiroyuki Ishii

Kuniaki Sato

Shigeru Ban

Shunichi Yamada

Masatoshi Ishida

Shozo Maeda

Yasuo Takenaka

Hirofumi Sasaki

Masafumi Yamamoto

Takuji Kobori

Nobuyuki Miyaki

Toshiaki Kadota

Tomotaka Shinoda

Kazuaki Niwa

Shintarou Fujitomi

Fumiko Yonezawa

Takuju Kobori

Satoshi Oorui

Satoshi Orui

Hiroshi Ikeda

Phillip Joe Brock

Masahiro Kaneko

Makoto Sugiura

Eiji Yoneda

Toshikazu Yamada

Satoshi Ebata

Kouichi Fujiwara

Akimasa Soyano

Thomas I Wallow

Kenji Hoshiko

The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23&#xb0; C., and the circuit hoard satisfying a relationship: (A&#x2212;B)/B&#x2264;0.1 wherein A is the maximum value of the thickness in the wiring portion (&#x3bc;m) and B is the minimum value of the thickness in the non-wiring portion (&#x3bc;m).

Circuit board

Provided is a high-frequency circuit laminate that can reduce the transmission loss of electrical signals in high-frequency circuits and produce circuit boards with excellent smoothness. The high-frequency circuit laminate according to the present invention includes a metal layer and a resin layer which are laminated in contact with each other, the resin layer having an elastic modulus from 0.1 to 3 GPa, and the resin layer having an dielectric loss tangent from 0.001 to 0.01 and a relative permittivity from 2 to 3 at a frequency of 10 GHz at 23&#xb0; C.

High-frequency circuit laminate and method for producing same, and B-stage sheet

The present disclosure relates to a method of producing a microfluidic device, a microfluidic device, and a photosensitive resin composition, the method including the steps of: forming a resin layer on a support from a photosensitive resin composition that includes a compound having at least two radical-polymerizable groups, a photoradical generator, a compound having at least two cationically reactive groups, a photocation generator, and at least one compound selected from a protective group-containing amine, a photodegradable base, an imide structure-containing compound, an amide structure-containing compound and an urea structure-containing compound; partially UV-exposing and developing the resin layer; preparing a laminate by placing a cover material on the thus developed resin layer; and UV-exposing the thus obtained laminate.

Method of producing microfluidic device, microfluidic device, and photosensitive resin composition

A radiation-sensitive resin composition comprising an acid-labile group-containing resin obtained by living radical polymerization having a specific structure which is insoluble or scarcely soluble in alkali, but becomes alkali soluble by the action of an acid, and a photoacid generator, wherein the ratio of weight average molecular weight to number average molecular weight (weight average molecular weight/number average molecular weight) of the acid-labile group-containing resin is smaller than 1.5.

Radiation-sensitive resin composition

The invention provides novel acid generators which are unproblematic in combustibility and accumulation inside the human body and can generate acids having high acidities and high boiling points and exhibiting properly short diffusion lengths in resist coating films and which permit the formation of resist patterns excellent smoothness with little dependence on the denseness of a mask pattern; sulfonic acids generated from the acid generators; sulfonyl halides useful as raw material in the synthesis of the acid generators; and radiation-sensitive resin compositions containing the acid generators. The acid generators have structures represented by the general formula (I), wherein Ris a monovalent substituent such as alkoxycarbonyl, alkylsulfonyl, or alkoxysulfonyl; Rto Rare each hydrogen or alkyl; k is an integer of 0 or above; and n is an integer of 0 to 5. Among the radiation-sensitive resin compositions, a positive one contains a resin having acid-dissociable groups in addition to the above acid generator, while a negative one contains an alkali-soluble resin and a crosslinking agent in addition to the acid generator.

Acid generators, sulfonic acids, sulfonyl halides, and radiation sensitive resin compositions

A radiation-sensitive resin composition suitable as a chemically-amplified resist useful for microfabrication utilizing various types of radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser. The radiation-sensitive resin composition of the present invention comprises: (A) a resin comprising a recurring unit (1-1) shown by the following formula (I-1) and (B) a radiation-sensitive acid generator such as 1-(4-n-butoxynaphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition may further comprise (C) an acid diffusion controller such as phenylbenzimidazole. 

1. A radiation-sensitive resin composition comprising: (A) a resin insoluble or scarcely soluble in alkali, but becomes alkali soluble by the action of an acid and (B) a photoacid generator. The resin comprises (a) at least one recurring unit of the following formula (1-1) or (1-2), and (b) at least one recurring unit for the following formula (2-1), (2-2), or (2-3). 

A radiation-sensitive resin composition suitable as a chemically-amplified resist useful for microfabrication utilizing various types of radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser. The radiation-sensitive resin composition of the present invention comprises: (A) a resin comprising a recurring unit (1-1) shown by the following formula (I-1) and (B) a radiation-sensitive acid generator such as 1-(4-n-butoxynaphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition may further comprise (C) an acid diffusion controller such as phenylbenzimidazole 

The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.

Photoresist polymers

Photoresist polymer compositions

Synthesis of photoresist polymers

A radiation-sensitive resin composition comprising (A) a resin containing a structural unit of the following formula (I), (B) a resin containing a recurring unit of the following formula (II), and (C) a photoacid generator, wherein Rrepresents a substituted or unsubstituted divalent (alicyclic) hydrocarbon, Rrepresents a lower alkyl group or a monovalent (substituted) alicyclic hydrocarbon group, or any two Rs form in combination a divalent (substituted) alicyclic hydrocarbon group, with the remaining Rbeing a lower alkyl group or a monovalent (substituted) alicyclic hydrocarbon group, wherein Rrepresents a hydrogen atom, fluorine atom, or trifluoromethyl group, Rrepresents a (substituted) hydrocarbon group with a valence of (c+1), (substituted) alicyclic hydrocarbon with a valence of (c+1), or (substituted) aromatic group with a valence of (c+1), Rrepresents a hydrogen atom or a monovalent acid-dissociable group, a and b individually represent an integer of 0-3, provided that (a+b)&#x2267;1 is satisfied, and c is an integer of 1-3. The radiation-sensitive resin composition has a high transparency at a wavelength of 193 nm or less and is particularly excellent in LER.

Radiation sensitive resin composition

A radiation sensitive dielectric constant changing composition comprising (A) a decomposable compound, (B) a nondecomposable compound, (C) a radiation sensitive decomposer and (D) a stabilizer. The composition allows its dielectric constant to be changed by a simple method, has a sufficiently large difference between its changed dielectric constant and its original dielectric constant and can provide a dielectric constant pattern and an optical material which are stable regardless of their use conditions.

Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern

To provide a refractive index pattern and an optical material whose refractive indices are changed by a simple method, which have a sufficiently large refractive index difference and which are stable irrespective of their use conditions, and a method of forming these. A radiation sensitive refractive index changing composition comprising (A) a decomposable compound, (B) a hydrolyzate of an alkoxide such as tetrabutoxytitanium, tetramethoxyzirconium, tetramethoxygermanium or tetramethoxysilane, or a halogen compound such as tetrachlorosilane and (C) a radiation sensitive decomposer; and a method of producing a refractive index pattern and an optical material, using the above radiation sensitive refractive index changing composition.

Radiation-sensitive composition changing in refractive index and utilization thereof

Growing community of inventors

Tokyo, Japan

Isao Nishimura