Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Isao Muragishi

Takashi Suzuki

Takashi Kanehisa

Takeshi Koiwasaki

Masahiro Yamamoto

Hitoshi Yamanishi

Masashi Makino

Kunio Nakada

Tetsuo Hori

Syozi Nishitani

Satoru Mitani

Mitsunori Yokomakura

Masaya Sakaguchi

Tadashi Kimura

Hiroyasu Tsuji

Hiroyoshi Sekiguchi

Daisuke Yamamoto

Makoto Inada

Mitsuhiro Yoshinaga

Asao Iguchi

Saito Daishiro

Tetuo Hori

Kai Takayuki

A base conductive member is formed on a surface and in a hole section of a substrate, and a resist is formed on a part of the base conductive member in which a conductive layer is not to be formed. The conductive layer is formed on a part except for the part in which the resist has been formed, and a mask metal is formed on the conductive layer. Then, the resist is removed, and the base conductive member is etched using the mask metal as a mask to form the conductive layer into a predetermined shape.

Semiconductor device manufacturing method and semiconductor device

The present invention is to provide a sputtering apparatus and a sputtering method, specifically, a magnetron sputtering apparatus having a magnetron electrode capable of generating plasma in a wide region near the surface of a target, and a sputtering method using the apparatus. Thereby, a magnetic field shape enabling to generate plasma in a wide region near the surface of a target is realized, the use efficiency of the target material is increased, and dusts and abnormal electric discharges may be prevented. Magnetic circuitof a magnetron electrode is set as 'magnetic circuitin which center perpendicular magnet, inside parallel magnet, outside parallel magnet, and perimeter perpendicular magnetare arranged' from the central part of targettoward the perimeter part, and inside parallel magnetis brought close to target

Sputtering apparatus and sputtering method

Provided is a partial pressure measuring method and a partial pressure measuring apparatus by which a partial pressure distribution is easily measured in a vacuum chamber. The partial pressure measuring method and the partial pressure measuring apparatus includes: moving a local plasma source dedicated to partial pressure measuring provided in the vacuum chamber, to a location at which the measuring is to be performed; and measuring a partial pressure distribution in the vacuum chamber, by receiving emission of plasma generated by the local plasma source through a window which is formed in a wall part of the vacuum chamber and through which the emission passes, and thereby performing emission spectral analysis on intensity of the emission.

Partial pressure measuring method and partial pressure measuring apparatus

As an electrically conductive layer or a lower layer of conductor layers to be patterned, a conductor layer which is dry-etchable with an oxygen-containing gas is provided. A dry etching process of the conductor layer with the oxygen-containing gas is performed highly selectively to a ground film.

Thin film device and method for manufacturing thin film device

According to the bonding method of flat electrodes of the present invention, a crystal glass material is arranged between electrodes, heated, and melted while the flat electrodes are pressured, and the melted crystal glass material is fused and re-crystallized to the surface of each flat electrode, so that the flat electrodes can be bonded with strong bonding force. Since a plate-like spacer or an application glass of a low melting point is not used in the method, disadvantages resulting from the spacer or the glass can be removed.

Method for laminating and bonding flat electrodes

A method and apparatus for joining flat-plate electrodes wherein a spacer, to which a joining material such as a low-melting-point crystallized glass containing a crystallization promoting agent is applied, is interposed between the electrodes to be joined. The electrodes and spacer are placed and held between upper and lower attraction dies. The upper and lower attraction dies are placed between upper and lower heating blocks for heating and pressing the electrodes and spacer through the attraction dies to join the electrodes via molten joining material.

Method of joining flat-plate electrodes

A method is disclosed for manufacturing a flat display device including line cathodes arranged at regular intervals, a plurality of flat electrodes arranged so as to be spaced apart by a predetermined distance from one another to control line electron beams generated from the cathodes, and a fluorescent substance which emits a light as a result of a collision of the electron beam. The method includes the steps of: arranging a bar-shaped low-melting glass at a connecting position where the beam generated from the cathode does not pass through; positioning the electrodes and the glass against each other when the electrodes are fixed to connect to the glass; fixing initial connecting portions of the electrodes to the glass, each of which is located outside an outer frame of each electrode; heating and fusing the glass to connect it to the electrodes; and removing the initial connecting portions of the electrodes arranged outside the outer frames of the electrodes from the electrodes.

Method for manufacturing flat display device

A fixed construction for plate electrodes in a flat display unit, wherein holes provided along a common axis through a plurality of plate electrodes have a diameter smaller than that of a tapered insulating pin to be inserted therein, and the peripheral portions of the holes are formed in a thin or tapered construction, thereby supporting and fixing the plate electrodes in position without interposing a spacer and without causing deformation to the areas around the peripheries of the holes formed in the plate electrodes when insulating pins are fitted.

Fixed construction for plate electrodes in a flat display unit

An edge-rounding method and an apparatus therefor, for chamfering the peripheral edge of a workpiece having a planar surface by causing the peripheral edge to be be engaged under pressure with a grinding surface of a grinding device. The grinding device employed is of two types, one type being a grinding cylinder having a grinding surface and the other type being an abrasive tape having an abrasive surface and moved around a rotary drum. The edge-rounding is performed on the workpiece so as to satisfy the relationship of [(x/r)-(L/2r)]&lt;0.015, wherein r represents the radius of the grinding surface, L represents the minimum dimension of the planar surface during the rotation of the workpiece and x represents the distance between the plane in which the workpiece pivots and the axis of rotation of the grinding device.

Edge-rounding method and apparatus therefor

An edge rounding machine for performing edge rounding of an outer edge portion of a machining face of a workpiece such as a floppy disk head, etc., including a cylindrical rotary member having, at its outer periphery, cutting edges, a holder for supporting the workpiece such that the machining face of the workpiece is brought into contact, at the outer edge portion, with a grinding face of the cylindrical rotary member at an angle, a rotary device for rotating the workpiece about its rotary centerline perpendicular to the machining face, a pivotal device for pivoting the workpiece, a support member for retractably guiding the holder along the rotary centerline of the workpiece, and an urging device for urging the workpiece towards the grinding face.

Growing community of inventors

Osaka, Japan

Isao Muragishi