Shin-etsu Handotai Co., Ltd.

Shin-etsu Handotai Kabushiki Kaisha

Isao Moroga

Masatake Katayama

Masaru Shinomiya

Yutaka Ohta

Akio Kasahara

Youichi Kumaki

Shoichi Fujiya

Isao Shirai

A method for producing a semiconductor substrate in which no autodoping occurs and slip dislocations in the substrate are reduced. The method involves forming a silicon nitride film on the backside of an n.sup.- -silicon substrate, epitaxially growing an n.sup.+ -buffer layer and a p.sup.+ -layer on the front side of the n.sup.- -silicon substrate, and decreasing the thickness of the n.sup.- -silicon substrate from the backside.

Method for producing semiconductor substrate

To provide a method of making a SOI film having a more uniform thickness in a SOI substrate which makes it possible to keep the variance at .+-.0.3 micrometers or less throughout the entire surface of the substrate, even for SOI substrates with a SOI film thickness between 1 micrometer and 10 micrometers. The surface of a SOI substrate is divided into a plurality of sections, then the SOI film thickness is measured for each section Wi (i=1-n) by means of the spectral interference method using an optical fiber cable, and, simultaneously, the SOI film is etched down to a prescribed thickness by a dry etching device, and thus a desired value and a variance (.+-.0.3 micrometers) of the SOI film thickness is obtained.

Method of making a SOI film having a more uniform thickness in a SOI

A method of diffusing boron into semiconductor wafers is disclosed which essentially includes boron deposition and boron diffusion. The deposition is performed from 900.degree. to 1,000.degree. C. and the diffusion at a temperature of 890.degree. to 1000.degree. C. Oxidation induced stacking faults are greatly reduced.

Method of boron diffusion into semiconductor wafers having reduced

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Annaka, Japan

Isao Moroga