Dai Nippon Printing Co., Ltd.

Isao Miyatani

Chikao Ikenaga

Yusuke Nakamura

Naoki Nishimura

Hiroshi Yano

Isao Inoue

Daigo Aoki

Yoko Nakamura

Masato Ushikusa

Hideyuki Okamoto

Yoshinori Murata

An organic device includes an outer edge, a wiring area and a display area that includes a first electrode, an organic layer on the first electrode and a second electrode on the organic layer. The wiring area includes a reference electrode connected to the second electrode and defining a reference potential. The display area includes a first area and a second area bordering the first area. The second area includes a normal area including the second electrode and transmission areas not including the second electrode and arranged in a first direction. The second electrode of the normal area includes connecting portions connected to the second electrode of the first area. The connecting portions include a first connecting portion located on the side of the first side in a second direction. The first connecting portion includes a facing connecting portion located between the transmission areas in the first direction.

Organic device and manufacturing method for organic device

A mask group may include two or more masks. When a section in a normal direction is viewed, a region-defining straight line may be defined as a straight line that forms an angle θ together with a first surface. The region-defining straight line may intersect the first surface at a first intersection point. An effective region may be defined as a region inside the first intersection point in the through-hole, and a peripheral region may be defined as a region outside the first intersection point in the through-hole. The angle θ may be 35° or more and 70° or less. The penetration region in the second mask region may include a hole overlapping region in which the through-holes of two masks overlap. The hole overlapping region may include a first hole overlapping region in which the peripheral regions of the through-holes of the two masks overlap.

Mask group, method of manufacturing organic device and organic device

A deposition mask according to an embodiment of the present disclosure includes a first surface, a second surface that is located opposite the first surface, and two or more through-holes. Each of the through-holes includes a first recess that is located at the first surface and a second recess that is located at the second surface. The deposition mask has a first mask region having a first surface remaining ratio that represents a remaining area ratio of the second surface and a second mask region having a second surface remaining ratio that represents a remaining area ratio of the second surface and that is higher than the first surface remaining ratio.

Deposition mask, deposition mask apparatus, deposition apparatus, and manufacturing method for organic device

A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer peripheral area that is adjacent to the outer frame part, and a central area which is surrounded by the outer peripheral area and has a thickness larger than a thickness of the outer peripheral area.

Deposition mask and method of manufacturing deposition mask

The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than &#x2212;10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.

Metal plate

The object of the present invention is to provide a metal plate having an excellent transportability. A maximum value of a steepness degree at a central area in a width direction of the metal plate is not more than 0.4%. In addition, the maximum value of the steepness degree at the central area is not more than a steepness degree at one end side area, and is not more than a steepness degree at the other end side area. Further, a difference between the maximum value of the steepness degree at the one end side area and the maximum value of the steepness degree at the other end side area is not more than 0.4%.

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Tokyo, Japan

Isao Miyatani