Omron Corporation

Isao Makuta

Masayuki Shinohara

Kazuhide Hirota

Norikazu Kitamura

Koichi Takemura

Tomofusa Shibata

Yoshihisa Yamanaka

Masayuki Kojima

Yukihiro Takahashi

Yoshihiro Ueno

Mamoru Yabe

Yoshikaga Taguchi

Tetsuya Minobe

Toshikaga Taguchi

A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.

Transfer molding method, die structure, transfer molding device, and optical member

A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.

Light guide plate producing method, die structure, transfer molding apparatus, light guide plate, area light source device, liquid crystal display device, and mobile device

A light emission part in the form of a point light source composed of LED, etc., and a light conductive plate, and the light emission part is arranged in opposition to a light incident surface of the light conductive plate. First diffusion patterns and second diffusion patterns are provided alternately on the light incident surface. The first diffusion patterns comprise a V-groove provided on an inner surface of a rectangular-shaped recess provided concavely on the light incident surface. The second diffusion patterns comprise a V-groove provided on the light incident surface. When a virtual line segment in parallel to a line segment drawn from the light emission part to a corner of the surface light emission region of the light conductive plate is drawn from an end of the recess, the V-groove and the second diffusion patterns are provided not to get over the virtual line segment.

Surface light source equipment and apparatus using the same

A point-light-source type light emitting portion faces a light incident face located at a corner portion of a light guide plate. A light diffusion pattern for emitting the light in the light guide plate from a light emission face is on the lower surface of the light guide plate. A diffusion prism sheet is on the light emission face. A prism sheet including prisms each having a concentric shape with the light emitting portion at the center is on the lower surface of the diffusion prism sheet, and an uneven diffusion plate is on the upper surface of the diffusion prism sheet. Light emitted from the light emission face of the light guide plate along the light emission face is deflected in the direction perpendicular to the light guide plate by the prism sheet, and the angle of beam spread of the light is spread by the uneven diffusion plate.

Surface light source device, diffusion plate and liquid crystal display device

By use of a simple structure, also without enlarging thickness and size too much, provided is a light emitting module which can improve heat dissipation of a light emitting component. On a surface of a wiring substrate, a pair of lands face to each other, and two wiring line is connected to the land, respectively. A mounting side outside electrode of a light emitting component is connected to a lead frame to which a light emitting element is die-bonded, and a non-mounting side outside electrode is connected to a lead frame which is connected to the light emitting element through a bonding wire. And, the mounting side outside electrode is bonded to the land by solder, and the non-mounting side outside electrode is bonded to the land by solder and thereby, the light emitting component is mounted on the wiring substrate. A line width of the wiring line at a side to which the mounting side outside electrode of the light emitting component is soldered is made to be larger than a line width of the wiring line at a side to which the non-mounting side outside electrode is soldered.

Light emitting module

Growing community of inventors

Kusatsu, Japan

Isao Makuta