Toshiba Memory Corporation

Kabushiki Kaisha Toshiba

Isao Maeda

Koichi Nagai

Isao Ozawa

Katsuya Murakami

Yasuo Kudo

Akira Tanimoto

According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals

Semiconductor device and semiconductor package

A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.

Semiconductor device and semiconductor package having a plurality of differential signal balls

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Yokohama, Japan

Isao Maeda