Hitachi Techno Engineering Co., Ltd.

Isao Koromegawa

Akimi Miyashita

Mutsumasa Fujii

Hironori Toyoshima

Terumi Ogawa

Katsunori Shibata

Masashi Takagaki

Hazime Sato

A high vacuum hot press for producing a multi-layer board. The high vacuum hot press includes a pair of heat insulating members each comprising a heat insulating material and a thin metallic cover defining an evacuated hermetic space accommodating therein the heat insulating material. The heat insulating members are arranged on respective surfaces, facing each other on a pair of bolsters. A pair of hot plates are placed on the heat insulating members, respectively. A multi-layer workpiece is disposed between the hot plates in a sealed space in a sealing unit. The multi-layer work includes wafers and an adhesive base material. The sealed space is evacuated to a high vacuum by an evacuating unit, and the multi-layer workpiece is heated by a heating unit under a high vacuum. The high vacuum hot press is further provided with a bonding unit which shifts the bolsters relative to each other to open and close the sealing unit and to bond the wafers of the multi-layer workpiece to each others for producing the multi-layer board.

High vacuum hot press

The present invention provides an aligning apparatus which is capable of aligning auxiliary connecting plates such as a testing fixture plate so as to fit to both sides of a substrate. A camera 13a monitors aligning marks provided on a substrate 6 and a first auxiliary connecting plate (i.e. a lower surface testing fixture plate) 8 to carry out an aligning operation by moving the substrate 6 by means of an XY.THETA. table 5. A first plate-fitting member (a vacuum suction member) 32 fixes the substrate 6 and the first auxiliary connecting plate 8. On the other hand, a camera 13b monitors aligning marks provided on the substrate 6 and a second auxiliary connecting plate (i.e. an upper surface testing fixture plate) 11 to carry out an aligning operation by moving the second auxiliary connecting plate 11 by means of the XY.THETA. table 5. A second plate-fitting member (a vacuum suction member) 33 fixes the substrate 6 and the second auxiliary connecting plate 11. Thus, the auxiliary connecting plates can be accurately aligned on both sides of the substrate through one table.

Aligning apparatus for substrate

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Tsuchiura, Japan

Isao Koromegawa