Fujitsu Corporation

Isao Kawamura

Katsuhide Natori

Takeshi Nagai

Isao Watanabe

Koji Katsuyama

Seiichi Iwasa

Motoaki Tani

Hideyuki Motoyama

Haruhiko Yamamoto

Makoto Sasaki

Shoichi Miyahara

Tsutomu Iikawa

Eiji Horikoshi

Takeaki Sakai

Karuhiko Yamamoto

Shigeki Okamoto

A portable data processing apparatus such as a personal computer comprising in series a base portion, a top cover portion, a display housing portion, and a keyboard portion. These portions are pivotally connected one after another by first, second and third hinge means, respectively. The first, second and third hinge means are parallel to each other, so that the apparatus can adopt a spread position in which the keyboard portion and the display housing portion are spread to the front and a retracted position in which the keyboard portion overlaps the display housing portion. The top cover portion, the display housing portion, the keyboard portion, and the base portion are folded in a face-to-face relationship in the retracted position.

Folding portable data processing apparatus with three hinge points

A via hole structure for interlayer connection formed in an insulating film and a process for the formation of the same. Via holes are formed in an insulating film of a multilayer interconnected board or the like so as to have a shape such that when a metallic film for wiring is formed on the insulating film, the metal film can completely fill up the via holes. The via holes are formed by gradually increasing from the bottom toward the top of an insulating layer 8 the apertures of the via holes 7 formed in the insulating layer 8, comprised of a plurality of insulating resin film or photosensitive insulating resin film layers 2, 5, in a multilayer interconnected board comprising the insulating layer 8 laminated alternately with a wiring layer 13 comprised of an electric conductor.

Via hole structure and process for formation thereof

A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the heat generating device for transferring heat generated in the device to the cooling unit. The metal sherbet is metal, such as an In-Ga binary system, in which solids of an In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the device and the cooling unit.

Method of cooling a semiconductor device with a cooling unit, using

A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.

A process for laser welding a cover and a casing, each made of aluminum or an aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in sides of the casing, thereby providing holes through which input/output and source terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer on the surface of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and, welding the cover and the casing together by pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight, and sealing the cover and the casing hermetically.

Process for laser welding of aluminum based elements

Growing community of inventors

Yokohama, Japan

Isao Kawamura