Murata Manufacturing Co., Ltd.

Isao Kato

Norio Sakai

Akihiko Kamada

Mitsuyoshi Nishide

Harufumi Mandai

Kazuhiro Isebo

Atsushi Kumano

Hiromichi Kawakami

Jun Urakawa

Tomoya Yokoyama

Yoshihiko Nishizawa

Akira Baba

Tomonori Ito

Norio Yoshida

Kazuto Ogawa

Yuzo Kawada

An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.

Electronic component unit and manufacturing method therefor

A low temperature co-fired ceramic material includes a SiO&#x2014;BaO&#x2014;AlO-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of FeOand 0.30 to 0.55 parts by weight of zirconium in terms of ZrOrelative to 100 parts by weight of the SiO&#x2014;BaO&#x2014;AlO-based primary component. The SiO&#x2014;BaO&#x2014;AlO-based primary component preferably includes 47% to 60% by weight of SiO, 20% to 42% by weight of BaO, and 5% to 30% by weight of AlO.

Low temperature co-fired ceramic material, low temperature co-fired ceramic body, and multilayer ceramic substrate

An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

Electronic component and method for producing the same

A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

Wiring substrate, method of producing the same, and electronic device using the same

A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

Method for manufacturing a monolithic ceramic electronic component

A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component

There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

Method of producing ceramic multilayer substrate

A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Multilayer ceramic electronic component and manufacturing method thereof

Monolithic ceramic electronic component, method for manufacturing the same, and electronic device

A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.

Circuit-forming charging powder and multilayer wiring board using the same

It is an object of the present invention to provide a method of manufacturing ceramic electronic parts, with a reduced manufacturing time and a reduced manufacturing cost so as to be suitable for manufacturing many kinds or types of electronic parts but requiring only a small number of production steps. The method of producing ceramic electronic parts comprises a first process of printing an amount of electrified powder for forming a ceramic layer on a carrier member which is a film consisting of a polyethylene terephthalate (PET), so as to form a desired ceramic layer; a second process of printing an amount of electrified powder for forming internal electrodes on the ceramic layer, so as to form desired electrode patterns which will later be formed into desired internal electrodes; a third process of printing an amount of electrified powder for forming another ceramic layer on the above ceramic layer and the above electrode patterns, so as to form another desired ceramic layer.

Method of manufacturing ceramic electronic parts

An electrophotographic apparatus including a photosensitive member; a corona charger for charging a surface of the photosensitive member; a circuit-forming/chargeable powder supplying device for supplying circuit-forming/chargeable powder to a latent image pattern on the photosensitive member; a transferring device for transferring the circuit-forming/chargeable powder on the latent image pattern onto a ceramic green sheet; a flash lamp for fixing the circuit-forming/chargeable powder, transferred onto the ceramic green sheet, in order to form a circuit pattern (not shown) on the ceramic green sheet; and a circuit pattern forming position recognizing camera for detecting a circuit pattern forming position on the ceramic green sheet. In the electrophotographic apparatus, laser beams are used to form a predetermined latent image pattern (not shown) on a surface of the photosensitive member. Even when the electrophotographic apparatus is used for forming a circuit pattern on a print material by an electrophotographic method, the problem that a circuit pattern forming position shifts does not occur.

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Shiga-ken, Japan

Isao Kato