A.l.m.t. Corporation

Sumitomo Electric Industries, Limited

Sumitomo Electric Industreis, Ltd.

Isao Iwayama

Taichiro Nishikawa

Toshiya Ikeda

Shigeki Koyama

Ryota Matsugi

Yoshiyuki Takaki

Yoshihiro Nakai

Tetsuya Kuwabara

Misato Kusakari

Takehisa Yamamoto

Hideaki Morigami

Takanori Kadokura

Takahiro Nishimizu

Chieko Tanaka

Tatsuya Morikawa

Hiroyuki Kontani

Yuta Inoue

Masashi Okamoto

A composite material includes: coated particles, each of which includes a carbon-based particle made of a carbon-based substance and a carbide layer that covers at least a part of the surface of the carbon-based particle; and a copper phase that binds the coated particles to each other, wherein the carbide layer is made of a carbide containing at least one element selected from the group consisting of Si, Ti, Zr and Hf, and the average particle size of the carbon-based particles is 1 μm or more and 100 μm or less.

Composite material and composite material manufacturing method

A composite material contains a metallic phase, a non-metallic phase and a specific element. At least 90 mass % of the metallic phase is composed of at least one selected from the group consisting of Ag and Cu. The non-metallic phase includes a coated core material. The coated core material includes a core material and a carbide layer that covers at least a part of a surface of the core material. The core material contains at least one carbon-containing material selected from the group consisting of diamond, graphite, carbon fibers, and silicon carbide. The carbide layer contains a carbide of at least one metal element selected from the group consisting of Ti, Cr, Ta, and V. The specific element is at least one selected from the group consisting of Y and Mg. A total content of the specific element is 0.0004 mass % to 1.3 mass %.

Composite material

A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.

Heat radiation member

A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 &#x3bc;m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m&#xb7;K and a coefficient of linear expansion not greater than 10 ppm/K.

Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member

A heat radiating member includes: a composite portion composed of a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; and a metal layer formed on at least one surface of the composite portion and composed of a metal. A method for producing a heat radiating member includes: a preparation step to prepare a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; a powder arrangement step to dispose a metal powder composed of metal particles on at least one surface of the composite material; and a heating step to heat the composite material and the metal powder, with the metal powder disposed on the composite material, to form a metal layer composed of a metal of the metal powder on a composite portion composed of the composite material.

Heat radiating member and method for producing the same

A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.

Magnesium-based composite member, heat radiation member, and semiconductor device

A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01&#xd7;10and not more than 10&#xd7;10, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.

Composite member including substrate made of composite material

A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3%. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m&#xb7;K can be manufactured.

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Osaka, Japan

Isao Iwayama