Canon Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Isao Imamura

Akihiko Shimomura

Hiromichi Noguchi

Tadayoshi Inamoto

Kazunari Ishizuka

Shoji Shiba

Shimpei Otaka

Tamaki Sato

Hiroki Kihara

Sachiko Yamauchi

Isamu Horiuchi

Kouji Harada

Masashi Miyagawa

Yohei Sato

Yasushi Iijima

Masako Shimomura

Yohei Hamade

Tomohiro Takahashi

Yoshihiro Hamada

Hikaru Ueda

Ryoichiro Kurobe

Haruka Yamaji

Songhee Kim

Akio Kashiwazaki

Shogo Kawamura

Hiroto Matsuda

Masatsune Kobayashi

Shigeo Toganoh

Kenji Aono

Susumu Kadokura

Yoshiyuki Shino

Hiroyuki Shimoyama

Tsubasa Takaoka

Akane Hisanaga

Motohisa Abe

Kazunori Shioda

Hitomi Yamamoto

Hidetoshi Mukaida

Shigeru Mikami

There is provided an epoxy resin composition containing an epoxy resin, a solid basic compound, and a polythiol. By preparing a mixture 1 by kneading the epoxy resin with the solid basic compound, and then kneading the polythiol therewith, the dissolution of the solid basic compound into the polythiol is rate-limited to ensure the pot life, and due to a catalyst action by the dissolution of the solid basic compound at a time of heating, heat curability in a short time is realized.

Method for producing epoxy resin composition

An ink jet recording head that includes a substrate having an ejection orifice for ejecting a liquid and a member provided with a recessed portion for accommodating the substrate, the head including a gap formed between a wall of the recessed portion of the member and the substrate, and a sealing material that seals the gap, in which the sealing material contains a cured product of a composition containing at least a hydrogenated bisphenol A type epoxy resin, a solid basic compound, and polythiol.

Ink jet recording head

An inkjet recording head comprising a flow channel member, wherein the flow channel member is formed of a heat-cured product of a molding material comprising a resin composition comprising a thermosetting epoxy resin and a curing agent, and a filler; the filler comprises alumina and silica; and with d50 as a median diameter of the silica and with alumina A as the alumina having a median diameter of d50/4 or less, the content of the alumina A is 11 parts by mass or more relative to 100 parts by mass of the silica.

Inkjet recording head and method for producing same

A unit for electrostatic filter includes: a repeated structure of patterns that are respectively formed of one selected from at least two different substances having different work functions. The patterns formed of the different substances are put in contact with each other. The work functions differ by 1 eV or greater between the different substances put in contact with each other in the patterns.

Unit for electrostatic filter and electrostatic filter

There is provided an epoxy resin composition including: an epoxy resin, a thixotropic agent, a photobase generator, and an ether skeleton polythiol.

Epoxy resin composition

In an ink jet recording head including an electric wiring substrate having an electric contact terminal for receiving an electric signal from an ink jet apparatus, an electric wiring tape which electrically connects the electric wiring substrate and a recording element substrate to each other, and an adhesive sheet which fixes the electric wiring substrate and the electric wiring tape to each other, the electric wiring tape and the electric wiring substrate are fixed to each other with the adhesive sheet containing a polyester resin and an epoxy resin.

Ink jet recording head using adhesive sheet and method of manufacturing the same

Provided is an ink jet recording head having a flow path member. The flow path member is made of a thermoset product of a thermosetting molding composition containing a solid epoxy resin composition containing an epoxy resin and a phenolic resin, each solid at ordinary temperatures, and an alumina filler.

Ink jet recording head and method of manufacturing same

A liquid ejection head includes a substrate having an ejection opening through which a liquid is ejected, a recessed member having a wall defining a recess in which the substrate is disposed away from the wall with a gap therebetween, and a sealing member filling the gap. The sealing member includes a cured product of a composition containing a first polyol compound, an isocyanate compound having an isocyanate group, and a second polyol compound that is more reactive with the isocyanate group than the first polyol compound.

Liquid ejection head

A liquid ejection head for ejecting a liquid, including a flow passage member, which is composed of a first resin and which is provided with a flow passage configured to come into contact with the liquid, and a plurality of resin-coated members having a core-sheath structure composed of a filler constituting an inner core and a second resin constituting an outer core, wherein the plurality of the resin-coated members are contained in the flow passage member.

Liquid ejection head and method for manufacturing flow passage member of liquid ejection head

A first sealant for sealing a region under an electrical connection portion and a second sealant for sealing a region on the electrical connection portion are used as sealants for the electrical connection portion for connecting an electric wiring member to an ejection energy generation element of a liquid ejection head, these sealants contain the same base agent and curing agent, and the linear expansion coefficients of the first sealant and the second sealant after curing are adjusted so as to become in a predetermined range.

Liquid ejection head and method for manufacturing the same

The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.

Molding material and liquid ejection flow path member using the same

Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.

Liquid ejecting head manufacturing method and liquid ejecting head

A sealant contains a dicyclopentadiene type epoxy resin represented by formula 1 below, a hydrogenated bisphenol A epoxy resin, and a photo-induced cationic polymerization initiator, in which the content of the dicyclopentadiene type epoxy resin is 15 to 40 parts by mass relative to 100 parts by mass of the total mass of epoxy resins contained in the sealant. where n represents an integer of 0 to 2.

Sealant, inkjet recording head using sealant, and method for manufacturing the same

A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/&#xb0; C. or more.

Liquid ejection head and method of manufacturing the same

A liquid ejection head includes a chip having a liquid ejection pressure generating element and an electrode terminal for electrically connecting the liquid ejection pressure generating element to an external source, an electrical wiring board having a lead wiring to be electrically connected to the electrode terminal, and a lead sealing material for covering an electrical connection portion between the electrode terminal and the lead wiring. The lead sealing material contains an epoxy resin which has an average number of functional groups per molecule of more than two and is solid at 25&#xb0; C., an acid anhydride curing agent having a polybutadiene backbone, a curing accelerator, and an inorganic filler.

Growing community of inventors

Kawasaki, Japan

Isao Imamura