Momentive Performance Materials Japan LLC

Toshiba Silicone Co., Ltd.

Daikin Industries, Ltd.

Isao Iida

Hisashi Mitsuhashi

Masanori Takanashi

Kenji Takenaka

Eiji Tanigawa

Atsushi Sakamoto

Kazuhisa Ono

Daigo Hirakawa

Hiroyoshi Iijima

Takeshi Sunaga

Makoto Sawada

Koki Otashiro

Tetsuo Fujimoto

Kazuki Maruhashi

A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Thermally conductive polyorganosiloxane composition

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

A siloxane compound represented by the general formula (1): where Ris a group having an alkoxysilyl group having 1 to 4 carbon atoms, Ris a linear organosiloxy group represented by the general formula (2): where each Ris independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each Ris independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Surface treatment agent for thermally conductive polyorganosiloxane composition

A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Method for producing a thermally conductive polysiloxane composition

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 &#x3bc;m to 150 &#x3bc;m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Thermally conductive polysiloxane composition

There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: RSi(OR)O(Rand Rrepresent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.

Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus

A room temperature-curable polyorganosiloxane composition is a two component-type room temperature-curable polyorganosiloxane composition including (A) a base composition and (B) a cross-linking agent composition. The component (A) contains (a1) polyorganosiloxane having a hydroxyl group or an alkoxy group at a molecular end and (a2) an inorganic filler. The component (B) includes (b1) an organosilicon compound having three or more hydrolyzable groups in one molecule, (b2) polyorganosiloxane having an alkoxy group at a molecular end and represented by the following general formula and, and (b3) a curing catalyst. In the two component-type room temperature-curable polyorganosiloxane composition, it is possible to appropriately adjust a compounding ratio of the base component and the cross-linking component according to the use of an automatic mixer/discharger or the like without deteriorating properties such as deep-part curability, curing uniformity, and storage stability.

Room temperature-curable polyorganosiloxane composition

A room-temperature-curable polyorganosiloxane composition includes: 100 parts by mass of polyorganosiloxane capped with hydroxyl groups at termini and having a viscosity (23&#xb0; C.) of 0.02 to 1000 Pa&#xb7;s; 1 to 200 parts by mass of a filler capable of imparting flame retardancy; 0.1 to 10 parts by mass of a partially hydrolyzed condensate of a silane compound of RSi(OR)wherein R('s) and R('s) independently represent a substituted/unsubstituted univalent hydrocarbon group, and 'a' represents a numerical value of 0&#x2266;a&#x2266;0.2 on average; 0.1 to 10 parts by mass of a silane compound of RSi(OR)wherein R's and R's) independently represent a substituted/unsubstituted univalent hydrocarbon group, or its partially hydrolyzed condensate having 3 or less Si atoms in its molecule; 0.1 to 10 parts by mass of an amine-functionalized silane compound of (RO)Si&#x2014;R&#x2014;NH&#x2014;Rwherein R's independently represent a substituted/unsubstituted univalent hydrocarbon group, Rrepresents a substituted/unsubstituted bivalent organic group, and Rrepresents a hydrogen atom, a substituted/unsubstituted univalent hydrocarbon group, or an aminoalkyl group; 0.001 to 10 parts by mass of a curing catalyst; and 1 to 1000 ppm of a platinum compound (in terms of the Pt content).

Room-temperature-curable polyorganosiloxane composition

A silicone rubber sponge composition obtained by compounding a polyorganosiloxane having an average degree of polymerization of 3,000 to 300,000, a reinforcing silica filler, 1,1'-azo-bis(1-acetoxy-1-phenylethane) as a foaming agent, and organic peroxides and/or addition reaction curing agents. The silicone rubber sponge composition can provide a silicone rubber sponge which has a high foaming ratio, has a fine and uniform cell structure, has excellent surface smoothness of the skin layer, does not show a surface tackiness, has a good compression set, and does not require a post cure of a long time.

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Tokyo, Japan

Isao Iida