Lintec Corporation

Isao Ichikawa

Hidekazu Nakayama

Naoya Saiki

Hironori Shizuhata

Osamu Yamazaki

Sayaka Tsuchiyama

Takeshi Mori

Yosuke Sato

Mikihiro Kashio

Takashi Akutsu

Akinori Sato

Sou Miyata

Yoji Wakayama

Yasunori Karasawa

Masaaki Furudate

Kaisuke Yanagimoto

Yuichi Kozone

Yukiharu Nose

Yuichiro Azuma

A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.

Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate

A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.

Method of manufacturing laminate

A film-shaped firing material () is provided, including first metal particles (), second metal particles (), and a binder component (), in which the average particle diameter of the first metal particles () is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles () is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.

Film-shaped firing material and film-shaped firing material with a support sheet

This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.

Film-shaped firing material, film-shaped firing material provided with support sheet, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material provided with support sheet

A film-shaped firing materialis provided, including sinterable metal particlesand a binder component, in which a content of the sinterable metal particlesis in a range of 15% to 98% by mass, a content of the binder componentis in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350&#xb0; C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350&#xb0; C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.

A film-shaped fired material of the present invention is a film-shaped fired materialwhich contains sinterable metal particlesand a binder component, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40&#xb0; C. to 600&#xb0; C. at a temperature-rising-rate of 10&#xb0; C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40&#xb0; C. to 600&#xb0; C. at a temperature-rising-rate of 10&#xb0; C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of 'A1&#x3c;B1&#x3c;A1+200 seconds' and a relationship of 'A1&#x3c;2000 seconds'.

Film-shaped fired material, and film-shaped fired material with support sheet

The present invention provides a film-shaped firing materialincluding sinterable metal particles, and a binder component, in which a content of the sinterable metal particlesis in a range of 15% to 98% by mass, a content of the binder componentis in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60&#xb0; C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60&#xb0; C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing materialwhich contains sinterable metal particles and a binder component, and a support sheetwhich is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.

Film-shaped firing material and film-shaped firing material with support sheet

The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (), a binder component (), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.

Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheet

An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.

Adhesive composition, adhesive sheet, and method for producing semiconductor device

An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Adhesive composition, adhesive sheet and production process for semiconductor device

An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Adhesive composition, an adhesive sheet and a production method of a semiconductor device

An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.

A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25&#xb0; C. of 100-5,000,000 mPa&#xb7;S.

Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device

An adhesive composition including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. Also provided is an adhesive sheet having an adhesive layer including the above-mentioned adhesive composition.

A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organophosphonium compound (D) as a thermal curing accelerator, and the content of the organophosphonium compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.

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Tokyo, Japan

Isao Ichikawa