Panasonic Corporation

Isao Hayami

Masaya Tateyanagi

Toshiyuki Fukuda

Shoichi Tanaka

Toru Nishikawa

Takanori Miya

Mitsuhiro Mishima

Syouichi Tanaka

The semiconductor device includes: a base; a first mount placed on the bottom of the base; a second mount placed on the top of the base; a first light-emitting element placed on the bottom of the first mount; and a second light-emitting element placed on the top of the second mount for emitting light. The first light-emitting element and the second light-emitting element are placed so that the emission direction of light from the second light-emitting element is at an angle of depression with respect to the emission direction of light from the first light-emitting element and that the emission direction of light from the first light-emitting element and the emission direction of light from the second light-emitting element substantially coincide with each other as viewed from above the base.

Semiconductor device

The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.

Electronic component tester

A caphaving a piece of glassformed at a laser irradiating position and covering a laser irradiating direction and an upper face of a package, is mounted onto the packagehaving lateral faces of a frame bodyformed in three directions other than the laser irradiating direction, so as to reduce the distance between a semiconductor elementand the piece of glassand to reduce a radiusof the piece of glass. The profile of the semiconductor device can be therefore lowered while maintaining the characteristics of a semiconductor laser. In addition, by mounting the semiconductor device, the profile of an optical pickup device can also be lowered.

Semiconductor device, method of manufacturing the same, and production equipment of the same

A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element.

Growing community of inventors

Hyogo, Japan

Isao Hayami