Kabushiki Kaisha Toshiba

Yamaichi Electronics Co., Ltd.

Isao Baba

Toshiyasu Ito

Satoshi Takeuchi

Junichi Asada

Kazunori Hayashi

Hideo Taguchi

Toshihiro Ushijima

Tsutomu Imamura

Takamitsu Sumiyoshi

There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

TAB type semiconductor device

An operation assuring structure of an electronic circuit board in a connector for the electronic circuit board including an insert plate portion disposed on an end portion of an electronic circuit board and adapted to be inserted into a receiving port of a connector, a plurality of signal electronic pads arranged on a surface of the insert plate portion, and a plurality of signal contacts disposed within the receiving port of the connector and adapted to be contacted to the signal electrode pads, wherein a cut-off grounding contact, which is not conductive to the electronic circuit board, is interposed between the signal contacts within the receiving port, and the cut-off grounding contact has a length dimension enough to extend in parallel to the signal contacts and to interpose a distal end thereof between the signal electrode pads on the insert plate portion.

Operation assuring structure of electronic circuit board in connector

A plastic package type semiconductor device comprises: a die pad consisting of a plurality of parts; a tab lead consisting of a plurality of parts holding the die pad; a flat type Jumper lead formed between the parts of the die pad; an electrical insulating type insulating film formed on the die pad; a semiconductor chip bonded on the insulating film by an adhesive; and a plastic mold as a plastic package for molding the die pad, the tab lead, the flat type Jumper lead, the insulating file, and the semiconductor device in the plastic mold, whereby the semiconductor chip is Insulated electrically from the die pad. In addition, a SOJ plastic package type semiconductor device has a configuration without the Jumper lead described above.

Semiconductor device having a flat jumper lead

A semiconductor device is provided with a semiconductor substrate, an oxide film formed on the surface of the semiconductor substrate, an electrode pad formed on a region arbitrarily limited to the surface of this oxide layer, an insulation protection film that is laminated and formed on a peripheral portion of the electrode pad and the surface of the oxide layer where a central portion of this electrode pad is exposed, and a metal barrier film that is formed by covering the surface of a central exposed portion of the electrode pad, to prevent the corrosion of an electrode surface when wires are bonded and the electrode pad and wires are connected. This semiconductor device is manufactured by a method including a step of forming an electrode pad on an oxide film, a step of laminating an insulation protection film on the electrode pad and the oxidation film and of implementing patterning by a resist film onto the insulation protection film and for the selective removal of the insulation protection film so that an opening is made in the insulation protection film in a portion on the electrode pad, a step of laminating a metal barrier film on the electrode pad and the resist film, and a step of removing the resist film so that a portion of the resist film in the metal barrier film is removed.

Semiconductor having an improved electrode pad

In a lead frame for use in a plastic mold type semiconductor device having a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame and for supporting the die pad, a plurality of leads whose inner ends of the leads are disposed around the die pad and the leads have inner leads portions which are portions to be sealed in a mold, metal plated region applied only to cover the inner lead and opposite end portions of the the die pad respectively confronting the inner leads, but the tie bar is not plated.

Growing community of inventors

Fujisawa, Japan

Isao Baba