Sumitomo Electric Device Innovations, Inc.

Tonen Sekiyukagaku K.k.

Other

Tokyo Shibaura Denki Kabushiki Kaisha

Toa Nenryo Kogyo, K. K.

Tonen Sekiyukagaku Kabushiki Kaisha

Isao Baba

Masato Komatsu

Noboru Yamamoto

Takashi Mikami

Kiyotada Narukawa

Tsuyoshi Kanai

Haruyoshi Ono

Masaaki Isoi

Takeo Kondo

Leiichi Yanagisawa

Makoto Sugiyama

Yuji Gomi

Kenji Kohguchi

An alignment apparatus and an alignment method that enables to align an optical device with a receptacle, where the optical device and the receptacle have respective axes tilted to each other. The method includes steps of: (1) obtaining a minimum pressure caused to the optical device from the receptacle as varying a rolling angle around the X-axis of the optical device but fixing the pitching angle around the Y-axis at a rotating angle around the Z-axis; (2) determining a rotating angle where thus obtained minimum pressure becomes the minimum; and (3) iterating those procedures until the rotating angle obtained as varying the rolling angle and another rotating angle obtained as varying the pitching angle substantially coincides to each other.

Method for assembling optical module

Disclosed is a test apparatus including: test target sections each having a connector to connect a Device Under the Test (DUT); measuring sections that include measuring devices that have same measuring item respectively; a switch section that switches connection between the test target section and the measuring section under direction of a controller; wherein the controller selects one of the algorithms of connection, 1) searching vacancy of the measuring sections and directs the switch section to make a path between the test target section and the measuring section of vacancy, 2) holding the path that former selected.

Test apparatus

A testing method of a semiconductor laser emitting a wavelength under a test different from a reference wavelength in a given wavelength range includes: a first step of obtaining a length of an optical fiber under the test satisfying a reference dispersion condition at the wavelength under the test, based on the reference dispersion condition for the test and a unit dispersion amount of the optical fiber; and a second step of inputting a modulation signal that is a modulated laser light of the semiconductor laser having a wavelength as the wavelength under the test into an optical fiber having substantially the same length as the length obtained in the first step and evaluating an output of the optical fiber.

Testing method of semiconductor laser and laser testing device

A resin composition for bumpers including:

Resin composition for bumpers

Thermoplastic elastomer composition

A two-step process for production of thermoplastic elastomer, which comprises dynamically vulcanizing polypropylene and olefinic rubber in the presence of peroxide (1st step), and dynamically vulcanizing the vulcanized mixture, polypropylene and halogenated butyl rubber in the presence of zinc oxide (2nd step). In another method (a) polyolefin and olefin rubber are dynamically cross-linked in the presence of an organic peroxide and (b) in a separate second operation a dynamically vulcanized blend comprising polyolefin and halogenated butyl rubber is prepared and mixed with (a) to disperse (a) and (b) in one another. The thermoplastic elastomer composition is useful in materials for parts of automobiles. In an example, pp 9 wt. % parts, EPDM 21 wt. % parts, peroxide 0.3 wt. % part and divinylbenzene 0.5 wt. % part were blended and supplied to the first hopper (1) of biaxial extruder as shown in a figure. In the first blending zone (2), temperature and residence time are 200.degree. C. and 60 seconds respectively. And then, to the second hopper (3) of the extruder, pp 50 parts and the vulcanized product (EPDM+chlorinated butyl rubber) 20 parts were supplied and extruded in the heat blending zone (4) above mentioned mixture for 30 seconds of residence time. The physical properties of the composition are MFR: 18, Flex. Mod.: 3,300 (23.degree. C.) and 1,150 (80.degree. C.), Tens. at break: 105, Elong.: 420%, Izod.: No break (room temperature) and 25 (-40.degree. C.) Shore-D: 58, Flow marks: good and paintability: 100/100.

Method for preparation of thermoplastic resin composition

An input protection device for a C-MOS device having an n-type semiconductor substrate and a p-type well region. The device comprises a diode consisting of the p-type well region and an n.sup.+ -type layer diffusion formed in the p-type well region and connected between a gate of a C-MOS FET and ground. The n.sup.+ -type layer of the diode has a higher impurity concentration and a greater diffusion depth than those of n.sup.+ -type layers formed in the p-type well region and constitute the source and drain of an n-channel MOSFET.

Input protection device for C-MOS device

Method of production of thermoplastic elastomer compounds

Method of manufacture of thermoplastic elastomer compounds

Growing community of inventors

Yokohama, Japan

Isao Baba