Mitsubishi Denki Kabushiki Kaisha

Isao Asaka

Shigeru Takada

Masahiro Tanaka

Kunio Kobayashi

A system and method suitable for inspecting a semiconductor device whose terminals are formed from solder balls and protrude from a package is provided, thus enabling high-speed inspection of a semiconductor device having a plurality of pins. Metal protuberances corresponding to respective terminals projecting from the bottom of a package of a semiconductor device are provided on an interface substrate. Contact sections corresponding to the respective metal protuberances are provided within each of a plurality of slide sections. The semiconductor device is set on the slide section such that the terminals are disposed opposite the respective metal protuberances. The slide sections are slid over the interface substrate, thereby bringing the side surfaces of the terminals of the semiconductor device into contact with the contact sections. Each of the contact sections is formed from a conductive contact plate, an elastic film, and a slide guide having rigidity.

System and method for inspecting a semiconductor device with contact sections that slide over the terminals of the semiconductor device

There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

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Tokyo, Japan

Isao Asaka