Nissan Chemical Industries Limited

Isao Adachi

Takahiro Sakaguchi

Yuki Sugawara

Tadashi Hatanaka

Hiroyuki Soda

A resin composition capable of forming a cured film having a high refractive index, high transparency and high heat resistance, and a polymer which is used for the resin composition. A polymer having a structural unit of Formula (1): wherein Aand Aare each independently an &#x2014;O&#x2014; group or a &#x2014;C(&#x2550;O)O&#x2014; group; X is a divalent organic group having at least one aromatic ring or heterocyclic ring, wherein, when the X has two or more aromatic rings or heterocyclic rings, the rings are optionally bonded to each other via a single bond, are optionally bonded to each other via a heteroatom, or optionally form a condensed ring; and Y is a divalent organic group having at least one aromatic ring or condensed ring. A resin composition, includes: the polymer; a cross-linking agent; and a solvent.

Polymer and resin composition containing the same

A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: (wherein Ais a Cor Calkenyl group or alkynyl group, and Ais a Calkenylene group or alkynylene group).

Thermosetting resin composition

There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.0% by mass with respect to the content of all components of the resin composition, except the solvent: wherein Ris each independently a hydrogen atom or a methyl group, X is &#x2014;O&#x2014; or &#x2014;NH&#x2014;, Ris a single bond or an alkylene group, Ris an alkyl group, a is an integer of 1 to 5, b is an integer of 0 to 4, Ris a divalent organic group having an ether bond and/or an ester bond, Ris an alkyl group, f is an integer of 1 to 5, g is an integer of 0 to 4, Ris a single bond or an alkylene group, Y is a single bond or an ester bond, A is a mono- to tetra-valent organic group which optionally contain at least one hetero atom, or a hetero atom, and h is an integer of 1 to 4.

Resin composition

There is provided a resin composition for forming a color filter underlayer film that can form a cured film having excellent solvent resistance, heat resistance, and transparency and can reduce generation of the color resist residue at the time of formation of a color filter on the cured film. The resin composition for forming a color filter underlayer film comprising: a homopolymer or a copolymer having a structure unit of Formula (1); an acid compound; a solvent; and a crosslinking agent in an amount of 0% by mass to 35% by mass based on a content of a solid content of the resin composition: (where Ris a hydrogen atom or methyl group; Ris a Chydrocarbon group having at least one hydroxy group as a substituent; and the Chydrocarbon group further optionally has an ether bond).

Resin composition for forming color filter underlayer film

A thermosetting resin composition for a flattened film or a microlens including: a copolymer having structural units of the following Formulae (1) and (2), wherein Rs are each independently a hydrogen atom or a methyl group, Ris a single bond or a Calkylene group, in which the alkylene group may have an ether bond in the main chain, and Ris an epoxy group or a Corganic group having an epoxy ring; and a solvent. 

Resin composition for flattened film or microlens

A non-photosensitive resin composition including: a self-cross-linkable copolymer having structural units of Formulae (1) and (2): wherein each Ris independently a hydrogen atom or methyl group; X is an &#x2014;O&#x2014; group or an &#x2014;NH&#x2014; group; Ris a single bond or a Calkylene group; Ris a Calkyl group; a is an integer of 1 to 5, b is an integer of 0 to 4, and when a and b satisfy 1&#x2266;a+b&#x2266;5, and b is 2, 3, or 4, such Roptionally differ from each other; Ris a divalent organic group of Formula (I), Formula (II), or Formula (III), and Ris an organic group having an epoxy group: wherein c is an integer of 0 to 3, d is an integer of 1 to 3, and each e is independently an integer of 2 to 6; and a solvent.

Non-photosensitive resin composition

A material from which a cured film exhibiting high solvent resistance, liquid crystal-alignment performance, heat resistance and high transparency can be formed. A composition for forming a thermoset film having photo alignment properties, the composition comprising: a component (A) that is an acrylic copolymer having a photodimerizing moiety and a thermal cross-linking moiety; a component (B) that is an acrylic polymer having at least one of a Calkyl ester group and a Chydroxyalkyl ester group and at least one of a carboxy group and a phenolic hydroxy group; and a component (C) that is a cross-linking agent.

Composition for forming thermoset film having photo alignment properties

A material from which a cured film exhibiting high solvent resistance, liquid crystal-alignment performance, heat resistance and high transparency can be formed. A composition for forming a thermoset film having photo alignment properties, including: a component (A) that is an acrylic copolymer having a photodimerizing moiety and a thermal cross-linking moiety; and a component (B) that is a cross-linking agent.

There is provided a photosensitive resin composition. A photosensitive resin composition including a component (A), a component (B); and a solvent, wherein the component (A) is a copolymer having a structural unit of Formula (1) and a structural unit of Formula (2): (where R0 is a hydroxy group or a carboxy group; R1 is a hydrogen atom or a methyl group; R2 is a single bond or a C1-5 alkylene group; R3 is a thermally cross-linkable monovalent organic group; and in a plurality of structural units of Formula (2), R1 are optionally different from each other), and the component (B) is a photosensitizer.

Growing community of inventors

Funabashi, Japan

Isao Adachi