Hitachi Plant Technologies, Ltd.

Hitachi Techno Engineering Co., Ltd.

Isao Abe

Noriaki Mukai

Mitsuhiko Sato

Makoto Homma

A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.

Micro-bump forming apparatus

A screen printing apparatus,has a roll paper vibrating device which vibrates roll paper in contact with the lower surface of a screen mask in a direction perpendicular to a moving direction of the roll paper while the roll paper is being moved in contact with the lower surface of the screen mask. Thereby, the roll paper in contact with the lower surface of the screen mask is moved in a waveform-shape pattern. Therefore, the cumulative contact area of the roll paper on the lower surface of the mask is increased, and it is possible to efficiently remove residue, such as paste attached onto the lower surface of the screen mask of the printing apparatus and paste attached inside pattern openings of the screen mask, to maintain a good printing performance.

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Katori, Japan

Isao Abe