Hitachi, Ltd.

Renesas Technology Corp.

Other

Hitachi Astemo Ltd.

Isamu Yoshida

Junichi Saeki

Kunihiko Nishi

Makoto Kitano

Aizo Kaneda

Sueo Kawai

Hiroshi Kikuchi

Asao Nishimura

Kunihiro Tsubosaki

Takashi Yokoyama

Gen Murakami

Akio Hasebe

Akihiro Yaguchi

Takashi Yamazaki

Hiroshi Hozoji

Kazuyoshi Oshima

Masahiro Ichitani

Shozo Nakamura

Hiroyoshi Kokaku

Noriyuki Kinjo

Masatsugu Ogata

Masanori Segawa

Syuuji Eguchi

Ichiro Anjoh

Ichiro Anjo

Tetsuro Matsumoto

Tetsurou Matsumoto

Shigeharu Tsunoda

Shuji Eguchi

Nae Yoneda

Michiharu Honda

Kenichi Otsuka

Kazuya Ooji

Masahide Harada

Shiro Yamashita

Kaoru Uchiyama

Michiaki Hiyoshi

Masahiko Asano

Takehide Yokozuka

Shinichi Fujiwara

Kazuhiro Sugino

Tooru Yoshida

Mutsuhiro Mori

Masachika Masuda

Osamu Ikeda

Koji Sato

Koji Sasaki

Masao Mitani

Naoya Kanda

Kazumi Kawamoto

Hiroaki Furuichi

Tetsuya Nakatsuka

Junichi Arita

Osamu Yamada

Ritsuro Orihashi

Kunio Matsumoto

Masaru Kamoshida

Katsunori Azuma

Shigeru Tokita

Michifumi Kawai

Hideto Yoshinari

Shinya Kawakita

Hideo Yamakura

Toshikazu Shigyo

Shosaku Ishihara

Ikuo Kawaguchi

Katsumi Kuroguchi

Shigenobu Maruyama

Ichiro Miyano

Toshihiro Yasuhara

Ukyo Ikeda

Yasuo Akutsu

Seiichi Hayakawa

Yasunori Iwafuji

Tarou Tonoduka

Susumu Ishida

Kenichi Imura

Akihiro Muramoto

Katsuya Oono

Hiroshi Ibe

An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

Electronic control device

Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

Sealing structure and manufacturing method thereof

A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.

Power module and manufacturing method thereof

A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

Power module and vehicle-mounted inverter using the same

A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Semiconductor device and electronic control unit using the same

A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

Power semiconductor module

An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150&#xb0; C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

Electronic device

The present invention is related to an optical communication module for transmitting high frequency signals (e.g., 10 Gbit/s and higher data rates) between an optical element and an external circuit. In an illustrative embodiment, the optical communication module includes signal transmission lines and ground lines formed on a ceramic substrate, a flexible wiring board, and a printed circuit board. The widths of the signal lines and the ground lines vary, as well as the spacing between the signal and ground lines. This facilitates characteristic impedance matching among the signal lines to within about 50&#x3a9;.

Optical communication module

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the 'Lead-On-Chip' or 'Chip-On-Lead' structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Semiconductor device

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Semiconductor devices and methods of making the devices

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the &ldquo;Lead-On-Chip&rdquo; or &ldquo;Chip-On-Lead&rdquo; structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame

Growing community of inventors

Yokohama, Japan

Isamu Yoshida