Mitsubishi Denki Kabushiki Kaisha

Isamu Yamamoto

Kunio Kobayashi

Shinji Semba

Jiro Fukushima

Shinji Enoshima

Kiyoshi Ishibashi

Yutaka Morita

Hideya Yagoura

Kiyoji Imanaka

Masahiro Yamane

Toshimi Watanabe

Keiji Itoga

A tape carrier includes an elongated electrically insulating tape divided into a plurality of separable tape sections. A semiconductor chip is mounted at each of a plurality of semiconductor device mounting portions having a plurality of leads on each of the tape sections. The semiconductor chips are connected to the respective leads. A plurality of testing connection terminals on each of the tape sections are connected to respective testing connection terminals by testing wires.

Method of testing semiconductor device and test apparatus for the same

Tape carrier, and test apparatus for the same

A method of forming a passivation film for protection of circuits and/or curcuit elements on semiconductor chips, IC chips, LSI chips, VLSI chips or microcomputer, wherein the resist film used in patterning the passivation film is employed as part of the passivation film after being subjected to post-baking, and the upper layer of the passivation film is made of a material selected from the group consisting of a light-sensitive polyimide, silicon resin, epoxy resin and silicon ladder polymer.

Method of forming a passivation film

A semiconductor device includes a laser diode and a light receiving element arranged on a common surface of a substrate and a monitor laser beam from the laser diode is reflected by a reflecting plate to the light receiving element. With the arrangement of the laser diode and the light receiving element on the same surface of the substrate, die-bondings and wire-bondings for the laser diode and the light receiving element can be performed in a single step. Thermal stress due to heat generation of the laser diode is minimized by a use of a sub-mount between the laser diode and the substrate.

Semiconductor device housing with laser diode and light receiving element

A method of constructing a semiconductor laser includes producing a lead frame having a central lead which is used as a die pad at its central portion and two outside leads connected to the central lead by tie bars, mounting a semiconductor laser chip and a light receiving chip on the central lead of the lead frame, connecting the semiconductor laser chip and the light receiving chip to respective outside leads with wires, sealing portions of the leads, the wires, and both chips in a transparent package, and cutting the tie bars to disconnect the outside leads from the central lead.

Method of packaging a semiconductor laser and photosensitive

The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction. The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.

Growing community of inventors

Hyogo, Japan

Isamu Yamamoto