Murata Manufacturing Co., Ltd.

Isamu Utsunomiya

Kiyoyuki Nakagawa

Kenichi Fukuda

Hiromitsu Ito

Yuichi Iida

An electronic component includes a glass substrate having a glass body and a protruding crystallized portion, the glass body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface to each other, and the first side surface having the crystallized portion; a colored insulation layer on the first side surface; and a through-conductor within the glass body and extending through the top surface and the bottom surface. The crystallized portion extends in a first direction that is parallel to the bottom surface, as viewed from a direction orthogonal to the first side surface. As viewed from the direction orthogonal to the first side surface, at least a portion of the colored insulation layer extends in the first direction and is disposed adjacent to the crystallized portion in a second direction that is orthogonal to the first direction.

Electronic component and manufacturing method thereof

A feeder for feeding electronic chip components includes a hopper having a discharge opening at its bottom and having and an aligning path forming member for agitating electronic chip components. The aligning path forming member agitates the electronic chip components by its reciprocating movement within the discharge opening of the hopper. The reciprocating stroke of the aligning path forming member can be varied, and the stroke is controlled to be shorter when the number of electronic chip components remaining in the hopper is reduced. This allows the electronic chip components to be guided more reliably into an aligning path formed by the aligning path forming member, regardless of the number of electronic chip components remaining in the hopper.

Component feeder apparatus and method

At least one partition wall is disposed in a hopper of a feeder for feeding electronic chip components. The at least one partition wall reduces the potential for damage to the components due to the reciprocating movement of a movable pipe disposed on the bottom of the hopper for agitating the electronic chip components. The reduced potential of degradation allows more electronic chip components to be accommodated in the hopper.

Feeder for electronic chip components

A feeder for electronic chip components is provided having an aligning path forming member agitating electronic chip components which are to be discharged from a discharge opening of a hopper for accommodating a plurality of electronic chip components. The agitation is achieved by reciprocating the aligning path forming member in the axis direction of the discharge opening and forming a tubular aligning path which receives only the electronic chip components aligned in a predetermined direction therein. When the aligning path forming member reciprocates it also rotates around its axis. This results in an increased agitating effect on electronic chip components for guiding them into the aligning path.

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Shiga-ken, Japan

Isamu Utsunomiya