The Furukawa Electric Co., Ltd.

Isamu Noguchi

Hiroyuki Nakae

Shinichi Ishiwata

Kazushige Iwamoto

Michio Ueyama

Yoshiyuki Funayama

Akio Nojiri

Takashi Sawasaki

Masayuki Kondo

Morikuni Hasebe

Junnosuke Sasazima

Shinji Onobori

There is disclosed a surface-protection method during chemical etching of a plate material, which comprises sticking a radiation-curable adhesive tape onto the area of plate material where etching should not be effected, and after the radiation-curable adhesive layer is cured with irradiation of radiation, subjecting said plate material to a chemical etching treatment.

Surface-protection method during etching

There is provided a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.

Radiation-curable adhesive tape

There is a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.

There is provided a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.

A crosslinked foam having an expansion ratio of 25 to 60 which comprises a composition containing 100 parts by weight of a resin component consisting of an ethylenevinyl acetate copolymer or a mixture thereof with a thermoplastic resin and 50 to 500 parts by weight of an inorganic powder material.

Crosslinked polyolefin foam containing a high concentration of an

A composition for a crosslinked polyolefin foam is prepared from 20 to 75% by weight of a crystalline propylene copolymer containing 1 to 15% by weight of ethylene and having a crystallinity higher than 50% and 80 to 25% by weight of polyethylene.

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Tokyo, Japan

Isamu Noguchi