Nichia Corporation

Other

California Institute of Technology

Isamu Niki

Motokazu Yamada

Masahiko Sano

Shuji Shioji

Naoki Saka

Axel Scherer

Yoshinori Murazaki

Yoichi Kawakami

Koichi Okamoto

Shigeo Fujita

Yukio Narukawa

Mitsuru Funato

Jun Kawamata

A method of manufacturing a light-emitting device includes: providing a light source including a first substrate and a light-emitting element coupled to the first substrate; and after the providing of the light source, forming one or more positioning holes in the first substrate at locations spaced apart from a light-emitting part of the light source by predetermined distances in a top plan view.

Method of manufacturing light-emitting device, method of manufacturing light emitting module, and light-emitting device

A method of manufacturing a light-emitting device includes: providing a light source having a first substrate and a light-emitting element coupled to the first substrate, and a second substrate defining one or more recesses or one or more through-holes; and positioning the second substrate above the first substrate, and adjusting a position of the second substrate such that the one or more recesses or the one or more through-holes define at least a part of one or more positioning holes respectively positioned at predetermined distances from a light-emitting part of the light source in a top plan view.

A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

Semiconductor light emitting device

A method for manufacturing a wavelength conversion member includes: forming a phosphor layer on a base body including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and forming a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and having a same oxide material as the oxide particles. A wavelength conversion member includes: a base body, a phosphor layer disposed on the base body and including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and including a same oxide material as the oxide particles.

Method for manufacturing wavelength conversion member

A wavelength converting member includes at least a first, second, and third regions, circumferentially on a disc-shaped light-transmissive substrate. The first region includes, from a light incident direction, a first and second phosphor layers. The first phosphor layer includes a first phosphor to absorb at least part of incident light and to emit a first light having a wavelength different from the incident light. The first phosphor layer defines an indentation in a surface on the second phosphor layer side, with a depth a half or more of the thickness of a portion of the first phosphor layer absent of the indentation. The second phosphor layer includes a second phosphor to absorb at least part of the first light emitted by the first phosphor and to emit a second light having a wavelength different from the first light, and is disposed in the indentation of the first phosphor layer.

Wavelength converting member and projector including the wavelength converting member

Growing community of inventors

Anan, Japan

Isamu Niki