Murata Manufacturing Co., Ltd.

Isamu Morita

Kuniaki Yosui

Bunta Okamoto

Jun Sasaki

Shinya Oguri

Yoshihito Otsubo

Norio Sakai

Satoshi Ishino

Yuya Dokai

Naoki Gouchi

Shingo Ito

Yuki Ito

Kanto Iida

Keisuke Araki

Wataru Tamura

An inductor bridge includes an inductor in a flexible, flat plate-shaped element body including resin bases that are laminated, and a wiring unit connected in series to the inductor. The inductor includes wound conductor patterns, each with a winding axis in a laminating direction of the resin bases and respectively provided on each of the resin bases, and an interlayer connection conductor interlayer-connecting the wound conductor patterns. The wiring unit includes a wiring pattern at a layer between a first surface of the wound conductor pattern and a layer farthest from the first surface and interlayer connection conductors conducted to the wiring pattern.

Inductor bridge and electronic device

A multilayer substrate includes a stacked body including first and second flexible insulating base material layers, and an actuator conductor pattern on at least the first insulating base material layer. The stacked body includes a first region including stacked first and second insulating base material layers, and a second region including stacked second insulating base material layers. The first region includes an actuator function portion in a portion thereof, the actuator function portion including the actuator conductor pattern. The thickness of the first insulating base material layer including the actuator conductor pattern is smaller than the thickness of one second insulating base material layer.

Multilayer substrate

An electronic device includes a transmission line and a circuit board. The transmission line includes a signal conductor, a base material, a first external connection conductor, a second external connection conductor, and a ground conductor, and defines a stripline. The circuit board includes a first mounting land conductor, a second mounting land conductor, and a radiation reduction conductor. The first mounting land conductor and the second mounting land conductor are provided in a concave portion on the surface of the circuit board, and are respectively connected to the first external connection conductor and the second external connection conductor. The radiation reduction conductor is provided on the lateral surface of the concave portion in which the transmission line is disposed, and is in contact with or adjacent to the first lateral surface and the second lateral surface of the base material.

Electronic device

A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.

An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

Electrical element, mobile device, and method for manufacturing electrical element

A multilayer substrate includes a base in which insulating base material layers including a thermoplastic resin are stacked, a conductor provided on at least one of the insulating base material layers, a ground electrode and a ground conductor, and a metal member connected to the conductor. The metal member is disposed inside the base and includes a portion extending in at least a stacking direction of the insulating base material layers and a portion extending in a planar direction parallel or substantially parallel to a principal surface of the insulating base material layers, and the metal member defines at least a portion of a circuit in contact with the base.

Multilayer substrate and electronic device

An antenna defined by a conductive pattern is in contact with a laminate including insulator layers, one of which has a conductive pattern thereon. A first insulator layer has a surface that is a first principal surface of the laminate. The laminate includes a thick wall portion and a thin wall portion, and an antenna defined by the conductive pattern is located on the surface of the first insulator layer and a portion of the antenna traverses a boundary between the thick wall portion and the thin wall portion.

Antenna element and method of manufacturing the same

A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.

Growing community of inventors

Nagaokakyo, Japan

Isamu Morita