Techno Polymer Company Limited

Jsr Corporation

Renesas Electronics Corporation

Techno-umg Co., Ltd.

Isamu Mochizuki

Kazuya Egawa

Atsushi Ito

Shin-ichiro Iwanaga

Hozumi Sato

Mika Mizutani

Katsumi Inomata

Yasuaki Yokoyama

Masaki Maeda

Masaru Ohta

Masahiko Nagasaka

Hiroshige Abe

Masaru Oota

Kouichi Hirose

An automobile interior part made of a thermoplastic resin composition [D] prepared by incorporating 0.1 to 8 parts by mass of a silicone oil [B] having a kinematic viscosity at 25&#xb0; C. of 10 to 100,000 cSt into 100 parts by mass of a rubber-reinforced vinyl resin [A], wherein [A] contains a diene rubber polymer [a1] and an ethylene-&#x3b1;-olefin rubber polymer [a2 ], the total amount of [a1 ] and [a2 ] is 5 to 30% by mass, and the mass ratio of [a1] to [a2], [a1]: [a2], is 10 to 85 : 90 to 15. The automobile interior part shows remarkably reduced generation of squeaking noises when members rub against each other, and this effect is maintained without deterioration even when being placed under high temperatures for a long time. The automobile interior part is also superior in impact resistance and molded appearance.

Automobile interior part with reduced squeaking noises

A contacting part made of a thermoplastic resin composition is provided, which is characterized in that generation of squeaking noises that are generated when members rub against each other is remarkably reduced, that an effect of reducing squeaking noises is maintained without deterioration even when being placed under high temperatures for a long time, and further that not only heat resistance, impact resistance, and moldability are superior, but also safety at the time of collision is superior because of ductile fracture. The contacting part made of a thermoplastic resin composition [X] is composed of

Contacting part made of thermoplastic resin composition with reduced squeaking noises

A contacting component and a structure including the contacting component are provided which are not only reduced in squeaking noises that are generated when comes into contact with and rubs against other members, but also superior in appearance of matting property. The contacting component comprises a molded article made from a thermoplastic resin composition (X) containing a vinyl graft polymer (A), a vinyl non-graft polymer (B) and a matting agent (C), wherein the vinyl graft polymer (A) contains an ethylene-&#x3b1;-olefin rubber polymer (a1), and the structure comprises the contacting component.

Contacting component and structure containing said contacting component

Provided is a thermoplastic resin composition in which filler such as glass fiber is incorporated to enhance rigidity, and which is further improved in hand touch feeling and occurrence of squeaking noise. The thermoplastic resin composition comprises a rubber-reinforced aromatic vinyl resin (A, B), a crystalline thermoplastic resin (C), and a fibrous or layered filler (D), wherein the thermoplastic resin composition has melting points, as measured according to JIS K7121-1987, between 0 and 100&#xb0; C. and between 170 and 280&#xb0; C., and a bending elastic modulus of 3,000 MPa or higher. The component (A) preferably comprises an ethylene/&#x3b1;-olefin rubbery polymer (a1) having a melting point of 0 to 100&#xb0; C. as measured according to JIS K7121-1987. The component (C) preferably has a melting point of 170 to 280&#xb0; C. as measured according to JIS K7121-1987, and is preferably at least one selected from the group consisting of a polyester resin and a polyamide resin.

Thermoplastic resin composition and molded article

Provided is a thermoplastic resin composition [X] for reduction of squeaking noises containing a rubber-reinforced vinyl resin [A] obtained by polymerizing a vinyl monomer [b1] in the presence of an ethylene-&#x3b1;-olefin rubber polymer [a1] having Tm (melting point) of 0&#xb0; C. or higher, wherein an amount of silicon contained in the thermoplastic resin composition [X] is 0.15% by mass or less based on 100% by mass of the thermoplastic resin composition [X]. According to the present invention, a structure can be provided, which is characterized in that squeaking noises that are generated when members rub against each other is remarkably reduced, that an effect of reducing squeaking noises is maintained without deterioration even when placed under high temperature for a long time, and that impact resistance and molded appearance are superior.

Thermoplastic resin composition for reduction of squeaking noises and structure of reduced squeaking noises

A contacting part made of a thermoplastic resin composition is provided, which is characterized in that generation of squeaking noises that are generated when members rub against each other is remarkably reduced, that an effect of reducing squeaking noises is maintained without deterioration even when being placed under high temperatures for a long time, and further that not only heat resistance, impact resistance, and moldability are superior, but also safety at the time of collision is superior because of ductile fracture. The contacting part made of a thermoplastic resin composition [X] is composed of:

The present invention is directed to lessen burden at the time of solving a conflict of overlapping processes in processes for a plurality of interruption factors. On completion of data transfer to an external memory, a data transfer completion interruption of high priority is generated. In the case where data transfer of predetermined number of packets is not completed in reception interruption, a timer interruption of low priority is generated. Before processing data in an external memory responding to the interruption, the number of transfer packets is obtained from a counter. After restart of reception, the counter stores the number of transfer restart packets. After obtaining the number of transfer packets from a counter responding to the occurrence of the timer interruption, a data transfer completion interruption is generated. According to the obtained number of transfer packets, execution of either a process responding to occurrence of the timer interruption or a process responding to occurrence of the data transfer completion interruption is omitted.

Semiconductor integrated circuit

The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of:

Two-layer film and method of forming pattern with the same

A positive-tone photosensitive resin composition for forming a thick film which is suitably used for photofabrication such as manufacture of circuit boards, a photosensitive resin film, and a method of forming a bump using the same. The photosensitive resin composition comprising (A) a novolac resin with a weight average molecular weight of 2,000-30,000, (B) a polyvinyl lower alkyl ether, (C) a polyphenol derivative compound with a molecular weight of 200-1,000, and (D) a compound containing a naphthoquinonediazido group.

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Tokyo, Japan

Isamu Mochizuki