Denki Kagaku Kogyo Kabushiki Kaisha

Isamu Ichikawa

Hiroyuki Kurimura

Yoshiyuki Kobayashi

Yoshitsugu Goto

Yukihiro Morimoto

Gosuke Nakajima

Tomoyuki Kanai

Hayato Miyazaki

Takako Hoshino

Norihiro Shimizu

Kenji Fukao

Kenji Tanaka

Yasunori Hayashi

Takayuki Nagumo

Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cmat a wavelength of 365 nm while heating the bonded body to 150&#xb0; C.-300&#xb0; C.

Method for disassembling bonded body, and adhesive

Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.

Method of manufacturing translucent rigid substrate laminate

Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250&#xb0; C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30&#xb0; C. to 250&#xb0; C. at a temperature increase rate of 10&#xb0; C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250&#xb0; C. or higher.

(Meth)acrylic resin composition

Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.

Method for separating bonded bodies using excimer light irradiation

Growing community of inventors

Shibukawa, Japan

Isamu Ichikawa