Mitsubishi Denki Kabushiki Kaisha

Isamu Hosono

Masahiko Akamatsu

Takao Kawabata

Yoshiro Shikano

Hiroshi Mitsuoka

Yoshio Kimura

A plurality of semiconductor elements alternating in compressive contact relationship hollow heat dissipation blocks are disposed below a coolant reservoir filled with a condensible coolant in its liquid phase having a liquid surface. The hollow blocks are connected to the reservoir through respective connection tubes to be filled with the liquid coolant. A condenser is disposed above the reservoir. One auxiliary tube is disposed within each connection tube and has an upper open end located below the liquid surface and short of a point where a condensed coolant from the condenser flows into the reservoir and a lower end opening within the associated block.

Vapor cooling device for semiconductor device

An electrical valve circuit apparatus which comprises an electrical valve circuit comprising a plurality of main control electrical valves operationally connected between a main DC circuit system and a main AC circuit system, at least one pair of commutating arms composed of at least two main control electrical valves for sequentially commutating the current, at least one arm of the group of commutating arms is an auxiliary DC circuit system, and an auxiliary electrical valve apparatus and an auxiliary power source connected in series to the auxiliary DC circuit system.

Electrical valve circuit apparatus

A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.

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Amagasaki, Japan

Isamu Hosono