International Business Machines Corporation

Isabelle Paquin

Kang-Wook Lee

William E Bernier

Donald W Henderson

Eric Duchesne

James Spalik

Charles C Bureau

Dragoljub Veljanovic

Sylvain Pharand

Rejean Paul Levesque

Denis Plouffe

Matthieu Lirette-Gelinas

An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

Enhanced cleaning for water-soluble flux soldering

A method of sorting laminates includes characterizing first shapes of laminates from measurements taken of each, assembling the laminates to derive a first relationship between the first shapes and yield loss, characterizing second shapes of the laminates from a reduced number of the measurements to derive a second relationship between the second shapes and yield loss, analyzing a change in the derived relationships to determine a least number of the measurements necessary for achieving the yield loss and sorting supplied laminates in accordance with a characterized shape of each, which is obtained from the least number of the measurements taken for each supplied laminate.

Characterizing laminate shape

A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.

Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder

Growing community of inventors

Bromont, Canada

Isabelle Paquin