Atotech Deutschland Gmbh

Isabel-Roda Hirsekorn

Arnd Kilian

Hans-Jürgen Schreier

Jens Wegricht

Hans Jurgen Schreier

Kilian Arnd

The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of &#x2267;1 &#x3bc;m as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.

Method for electroless plating of tin and tin alloys

The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.

Electroless palladium plating bath composition

An autocatalytic tin plating bath containing Snions, Tiions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.

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Paulinenaue, Germany

Isabel-Roda Hirsekorn