J. T. Baker Chemical Company

Environmental Management Associates, Inc.

Irl E Ward, Jr

Lisa G Hallquist

Thomas J Hurley

Philip M Papoojian

Stripping compositions for removing paints, varnishes, enamels and the like, from substrates comprising compositions of (a) an amide compound of the formula: ##STR1## and mixtures thereof, wherein R is selected from the group consisting of hydrogen, methyl, ethyl, propyl and phenyl; R.sub.1 and R.sub.2 are selected from the group consisting of hydrogen and methyl; and mixtures of said amide compounds; and (b) a carbonate compound of the formula: ##STR2## and mixtures thereof, wherein R.sub.3 and R.sub.4 are selected from the group consisting of methyl, ethyl or R.sub.3 and R.sub.4 together form a divalent ethylene, propylene or butylene group of a cyclic carbonate.

Stripping composition containing an amide and a carbonate and use thereof

A pellicle for use in projection printing comprises a pellicle in which the transparent film is formed from a polyvinyl butyral resin or from a casting composition which is a mixture of a polyvinyl butyral resin and a dispersion of colloidal silica and a silicone resin which is a lower aliphatic alcohol-water solution of the partial condensate of a silanol. A pellicle employing such films are useful in the near, mid and deep UV regions.

Pellicle compositions and pellicles thereof for projection printing

Polyvinyl butyrate pellicle compositions and pellicles thereof for

A pellicle for use in projection printing comprises a pellicle in which the transparent film is formed from the novel film forming reaction product of a polyvinyl butyral resin with a silane. Pellicles employing such films are useful in the near, mid and deep UV regions.

Stripping compositions for removing resist materials from substrates comprise compositions of a 2-pyrrolidinone compound and a diethylene glycol monoalkyl ether compound. Polyethylene glycol may be added to provide even more effective stripping compositions.

Stripping compositions and methods of stripping resists

Stripping compositions for removing resist materials from substrates comprise compositions of dimethylacetamide or dimethylformamide or a mixture thereof and a tetrahydrothiophene 1,1-dioxide compound. Either or both of polyethylene glycol and a diethylene glycol monoalkyl ether may be added to provide even more effective stripping compositions

Stripping compositions for removing resist materials from substrates comprise compositions of a 2-pyrrolidinone compound and a dialkyl sulfone compound. Either or both of polyethylene glycol and a diethylene glycol monoalkyl ether may be added to provide even more effective stripping compositions.

Stripping compositions for removing resist materials from substrates comprise compositions of a 2-pyrrolidinone compound and tetrahydrofuran compound. Either or both of polyethylene glycol and a diethylene glycol monoalkyl ether may be added to provide even more effective stripping compositions.

Stripping compositions for removing resist materials from substrates comprise compositions of a 2-pyrrolidinone compound and a tetrahydrothiophene 1,1-dioxide compound. Either or both of polyethylene glycol and a diethylene glycol monoalkyl ether may be added to provide even more effective stripping compositions.

Growing community of inventors

Easton, PA, United States of America

Irl E Ward, Jr