Sharp Kabushiki Kaisha Corporation

Ippei Yamaguchi

Masahiro Konishi

Yuhsuke Fujita

Hiroyuki Nokubo

Shin Itoh

Takashi Nakanishi

Hiroshi Yamashita

Yoshiaki Itakura

An electrode pattern () formed on a ceramics layer () in a substrate for a light emitting device (circuit board ()) of the present invention includes a first metal layer (), a second metal layer (), and an electrode terminal unit (), and the thickness of a part at which the electrode terminal unit () is not formed in the electrode pattern () is at least equal to or greater than 35 &#x3bc;m. Accordingly, it is possible to suppress heat resistance to be low.

Substrate for light emitting device and manufacturing method of substrate for light emitting device

A ceramic insulating film () having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (), and a light emitting element () is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus () having the light emitting element () provided on the substrate ().

Light emitting apparatus

A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

Light emitting device including a metal substrate for high heat dissipation and increased light efficiency

In a light-emitting device (), a wiring pattern including conductor wirings () and electrodes () is formed on a substrate (), and an Au layer () is formed on the wiring pattern.

Growing community of inventors

Osaka, Japan

Ippei Yamaguchi